Electromigration Modeling at Circuit Layout Level
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has...
| Cote: | Libro Electrónico |
|---|---|
| Auteurs principaux: | Tan, Cher Ming (Auteur), He, Feifei (Auteur) |
| Collectivité auteur: | SpringerLink (Online service) |
| Format: | Électronique eBook |
| Langue: | Inglés |
| Publié: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2013.
|
| Édition: | 1st ed. 2013. |
| Collection: | SpringerBriefs in Reliability,
|
| Sujets: | |
| Accès en ligne: | Texto Completo |
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