Electrical Design of Through Silicon Via

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Lee, Manho (Editor ), Pak, Jun So (Editor ), Kim, Joungho (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Temas:
Electronic circuits.
Computers, Special purpose.
Electronic Circuits and Systems.
Special Purpose and Application-Based Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Preface
  • 1 Introduction
  • 2 Electrical Modeling of a Through-Silicon Via (TSV)
  • 3 High-speed TSV-based Channel Modeling and Design
  • 4 Noise Coupling and Shielding in 3D ICs
  • 5 Thermal Effects on TSV Signal Integrity
  • 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain
  • 7 TSV Decoupling Schemes
  • Index.

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