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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...
| Cote: | Libro Electrónico |
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| Format: | Électronique eBook |
| Langue: | Inglés |
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Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2016.
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| Édition: | 1st ed. 2016. |
| Collection: | Springer Theses, Recognizing Outstanding Ph.D. Research,
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| Accès en ligne: | Texto Completo |