Design of Adhesive Joints Under Humid Conditions

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

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Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: da Silva, Lucas F. M. (Editor), Sato, Chiaki (Editor)
Format: Electronic eBook
Language:Inglés
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:Advanced Structured Materials, 25
Subjects:
Surfaces (Technology).
Thin films.
Mechanics, Applied.
Solids.
Polymers.
Aerospace engineering.
Astronautics.
Surfaces, Interfaces and Thin Film.
Solid Mechanics.
Aerospace Technology and Astronautics.
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