Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging /

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

Full description

Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Lee, Jong-Hoon (Author), Tentzeris, Manos M. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: Cham : Springer International Publishing : Imprint: Springer, 2008.
Edition:1st ed. 2008.
Series:Synthesis Lectures on Computational Electromagnetics,
Subjects:
Engineering.
Electrical engineering.
Telecommunication.
Technology and Engineering.
Electrical and Electronic Engineering.
Microwaves, RF Engineering and Optical Communications.
Online Access:Texto Completo
Table of Contents:
  • Introduction
  • Background on Technologies for Millimeter-Wave Passive Front-Ends
  • Three-Dimensional Packaging in Multilayer Organic Substrates
  • Microstrip-Type Integrated Passives
  • Cavity-Type Integrated Passives
  • Three-Dimensional Antenna Architectures
  • Fully Integrated Three-Dimensional Passive Front-Ends
  • References.

Similar Items