Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Lee, Tae-Kyu (Author), Bieler, Thomas R. (Author), Kim, Choong-Un (Author), Ma, Hongtao (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2015.
Edition:1st ed. 2015.
Subjects:
Electronics.
Optical materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Electronic Circuits and Systems.
Online Access:Texto Completo
Table of Contents:
  • Introduction
  • Interconnection : The Joint
  • Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
  • Microstructure Development; Solidification and Isothermal Aging
  • Thermal Cycling Performance
  • Mechanical Stability and Performance
  • Chemical and Environment Attack
  • Challenges in Future Generation Interconnects: Microstructure Again.

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