Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

Full description

Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: Kondo, Kazuo (Editor), Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer New York : Imprint: Springer, 2014.
Edition:1st ed. 2014.
Series:Nanostructure Science and Technology, 171
Subjects:
Electrochemistry.
Nanotechnology.
Electronics.
Condensed matter.
Electronics and Microelectronics, Instrumentation.
Condensed Matter Physics.
Online Access:Texto Completo
Table of Contents:
  • Copper Electrodeposition
  • Suppression Effect and Additive Chemistry
  • Acceleration Effect
  • Modeling and Simulation
  • Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects
  • Microstructure of Evolution of Copper in Nano-scale Interconnect Features
  • Direct Copper Plating
  • Through Silicon Via
  • Build-up Printed Wiring Boards
  • Copper Foil Smooth on Both Sides for Lithium Ion Battery
  • Through Hole Plating.

Similar Items