Advanced Thermal Management Materials

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Jiang, Guosheng (Autor), Diao, Liyong (Autor), Kuang, Ken (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Temas:
Energy policy.
Energy and state.
Electronics.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Metals.
Energy Policy, Economics and Management.
Electronics and Microelectronics, Instrumentation.
Engineering Thermodynamics, Heat and Mass Transfer.
Metals and Alloys.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction to Thermal Management in Microelectronics Packaging
  • Requirements of Thermal Management Materials
  • Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials
  • Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies
  • Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
  •  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
  • Al/SiC Thermal Management Materials
  • Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper
  • Future Trend of Advanced Thermal Management Materials.

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