Lead Free Solder Mechanics and Reliability /
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...
Call Number: | Libro Electrónico |
---|---|
Main Author: | Pang, John Hock Lye (Author) |
Corporate Author: | SpringerLink (Online service) |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
New York, NY :
Springer New York : Imprint: Springer,
2012.
|
Edition: | 1st ed. 2012. |
Subjects: | |
Online Access: | Texto Completo |
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