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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level an...
| Call Number: | Libro Electrónico |
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| Main Author: | |
| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | Inglés |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Edition: | 1st ed. 2013. |
| Subjects: | |
| Online Access: | Texto Completo |