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3D Integration for NoC-based SoC Architectures
Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems con...
| Call Number: | Libro Electrónico |
|---|---|
| Corporate Author: | |
| Other Authors: | , , |
| Format: | Electronic eBook |
| Language: | Inglés |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2011.
|
| Edition: | 1st ed. 2011. |
| Series: | Integrated Circuits and Systems,
|
| Subjects: | |
| Online Access: | Texto Completo |
MARC
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| 245 | 1 | 0 | |a 3D Integration for NoC-based SoC Architectures |h [electronic resource] / |c edited by Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch. |
| 250 | |a 1st ed. 2011. | ||
| 264 | 1 | |a New York, NY : |b Springer New York : |b Imprint: Springer, |c 2011. | |
| 300 | |a X, 278 p. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
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| 490 | 1 | |a Integrated Circuits and Systems, |x 1558-9420 | |
| 505 | 0 | |a Three-Dimensional Integration of Integrated Circuits - an Introduction -- The Promises and Limitation of 3-D Integration -- Testing 3D Stacked ICs Containing Through-Silicon Vias -- Design and Computer Aided Design of 3DIC -- Physical Analysis of NoC Topologies for 3-D Integrated Systems -- Three-Dimensional Networks-on-Chip: Performance Evaluation -- Asynchronous 3D-NoCs -- Design of Application-Specific 3D Networks-on-Chip Architectures -- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks -- 3-D NoC on Inductive Wireless Interconnect -- Influence of Stacked 3D Memory/Cache architectures on GPUs. | |
| 520 | |a Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures. | ||
| 650 | 0 | |a Electronic circuits. | |
| 650 | 0 | |a Software engineering. | |
| 650 | 1 | 4 | |a Electronic Circuits and Systems. |
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| 700 | 1 | |a Sheibanyrad, Abbas. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Pétrot, Frédéric. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Jantsch, Axel. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
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| 830 | 0 | |a Integrated Circuits and Systems, |x 1558-9420 | |
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