Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

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Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: Tong, Ho-Ming (Editor), Lai, Yi-Shao (Editor), Wong, C.P (Editor)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Subjects:
Electronics.
Electronic circuits.
Optical materials.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Optical Materials.
Online Access:Texto Completo

Internet

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