SpringerLink (Online service), Tong, H., Lai, Y., & Wong, C. (2013). Advanced Flip Chip Packaging (1st ed. 2013.). Springer US : Imprint: Springer.
Chicago Style (17th ed.) CitationSpringerLink (Online service), Ho-Ming Tong, Yi-Shao Lai, and C.P Wong. Advanced Flip Chip Packaging. 1st ed. 2013. New York, NY: Springer US : Imprint: Springer, 2013.
MLA (8th ed.) CitationSpringerLink (Online service), et al. Advanced Flip Chip Packaging. 1st ed. 2013. Springer US : Imprint: Springer, 2013.
Warning: These citations may not always be 100% accurate.