Cita APA (7a ed.)

SpringerLink (Online service), Fan, X., & Suhir, E. (2010). Moisture Sensitivity of Plastic Packages of IC Devices (1st ed. 2010.). Springer US : Imprint: Springer.

Cita Chicago Style (17a ed.)

SpringerLink (Online service), X.J Fan, y E. Suhir. Moisture Sensitivity of Plastic Packages of IC Devices. 1st ed. 2010. New York, NY: Springer US : Imprint: Springer, 2010.

Cita MLA (8a ed.)

SpringerLink (Online service), et al. Moisture Sensitivity of Plastic Packages of IC Devices. 1st ed. 2010. Springer US : Imprint: Springer, 2010.