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Three Dimensional System Integration IC Stacking Process and Design /
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...
| Cote: | Libro Electrónico |
|---|---|
| Collectivité auteur: | |
| Autres auteurs: | , , |
| Format: | Électronique eBook |
| Langue: | Inglés |
| Publié: |
New York, NY :
Springer US : Imprint: Springer,
2011.
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| Édition: | 1st ed. 2011. |
| Sujets: | |
| Accès en ligne: | Texto Completo |