Three Dimensional System Integration IC Stacking Process and Design /

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

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Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: Papanikolaou, Antonis (Editor), Soudris, Dimitrios (Editor), Radojcic, Riko (Editor)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2011.
Edition:1st ed. 2011.
Subjects:
Buildings-Design and construction.
Electronic circuits.
Building Construction and Design.
Electronic Circuits and Systems.
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