Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...

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Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: Tan, Chuan Seng (Editor), Gutmann, Ronald J. (Editor), Reif, L. Rafael (Editor)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2008.
Edition:1st ed. 2008.
Series:Integrated Circuits and Systems,
Subjects:
Electronics.
Optical materials.
Surfaces (Technology).
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Surfaces, Interfaces and Thin Film.
Technology and Engineering.
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