Greig, W. (2007). Integrated Circuit Packaging, Assembly and Interconnections (1st ed. 2007.). Springer US : Imprint: Springer.
Cita Chicago Style (17a ed.)Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. 1st ed. 2007. New York, NY: Springer US : Imprint: Springer, 2007.
Cita MLA (8a ed.)Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. 1st ed. 2007. Springer US : Imprint: Springer, 2007.
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