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Lin, Tingyu
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Lin, Tingyu
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Modeling, analysis, design, and tests for electronics packaging beyond Moore /
by
Zhang, Hengyun
,
Che, Faxing
,
Lin, Tingyu
,
Zhao, Wensheng
Published 2020
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Modeling, analysis, design, and tests for electronics packaging beyond Moore /
by
Zhang, Hengyun
,
Che, Faxing
,
Lin, Tingyu
,
Zhao, Wensheng
Published 2020
Call Number:
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Located:
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Texto completo
Electronic
eBook
QR Code
Related Subjects
Electronic apparatus and appliances
Emballage
Packaging
Appareils �electroniques
Appareils électroniques
