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|a 621.3815
|2 23
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|a Ma, Shenglin,
|e author.
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| 245 |
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|a TSV 3D RF integration :
|b high resistivity Si interposer technology /
|c Shenglin Ma and Yufeng Jin.
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| 264 |
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|a Amsterdam, Netherlands :
|b Elsevier,
|c 2022.
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| 300 |
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|a 1 online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
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|a Print version record.
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|a Three-dimensional integrated circuits.
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| 650 |
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|a Silicon
|x Electric properties.
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| 650 |
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|a Radio frequency integrated circuits.
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| 650 |
|
6 |
|a Circuits int�egr�es tridimensionnels.
|0 (CaQQLa)000275745
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| 650 |
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|a Circuits int�egr�es �a radiofr�equence.
|0 (CaQQLa)201-0418302
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| 650 |
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|a Radio frequency integrated circuits
|2 fast
|0 (OCoLC)fst01087325
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| 650 |
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7 |
|a Silicon
|x Electric properties
|2 fast
|0 (OCoLC)fst01118637
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| 650 |
|
7 |
|a Three-dimensional integrated circuits
|2 fast
|0 (OCoLC)fst01765149
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| 700 |
1 |
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|a Jin, Yufeng,
|e author.
|
| 776 |
0 |
8 |
|i Print version:
|a MA, SHENGLIN. JIN, YUFENG.
|t TSV 3D RF INTEGRATION.
|d [S.l.] : ELSEVIER - HEALTH SCIENCE, 2022
|z 0323996027
|w (OCoLC)1280275881
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| 856 |
4 |
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|u https://sciencedirect.uam.elogim.com/science/book/9780323996020
|z Texto completo
|
