Surfactants in precision cleaning : removal of contaminants at the micro and nanoscale /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Amsterdam, Netherlands : Elsevier, 2021.
Temas:
Surface contamination > Prevention.
Surface active agents.
Metal cleaning.
Nanoparticles.
Surface-Active Agents
Nanoparticles
Surfactants.
M�etaux > Nettoyage.
Nanoparticules.
surface active agent.
Metal cleaning
Surface active agents
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Front Cover
  • Surfactants in Precision Cleaning
  • Copyright Page
  • Contents
  • List of Contributors
  • About the Editors
  • Preface
  • 1 Introduction to Surfactants
  • 1 Introduction
  • 2 Hydrophilicity and Hydrophobicity of Surfactant Molecules
  • 3 Adsorption Mechanism
  • 4 Surface Tension
  • 5 Enhancement of Wettability
  • 6 Langmuir-Blodgett Films
  • 7 Krafft Point
  • 8 Surfactant States
  • 9 Micelles
  • 10 Microemulsions
  • 11 Surfactant Mixtures
  • 12 Adsorption at Surface/Interface
  • 12.1 Adsorption Basics
  • 12.2 Adsorption Isotherms
  • 12.3 Adsorption Thermodynamics
  • 12.4 Adsorption Kinetics
  • 13 Surfactant Aggregation and the Aqueous cmc
  • 14 Surfactant Partitioning Between Water and Oil
  • 15 Surfactant Precipitate and Colloid Formation
  • 16 Salt/Ion Effects on Surfactant Behavior
  • 17 Summary
  • Acknowledgment
  • References
  • 2 Surface Contaminants and Surface Cleanliness Levels
  • 1 Introduction
  • 2 Sources and Generation of Contaminants
  • 2.1 Particles
  • 2.1.1 Forces of Adhesion
  • 2.2 Thin-Film or Molecular Contamination
  • 2.3 Ionic Contamination
  • 2.4 Metallic Contaminants
  • 2.4.1 Metal Impurities and Particles
  • 2.5 Microbial Contamination
  • 3 Impact of Contaminants
  • 3.1 Particle Contamination
  • 3.1.1 Health Effects
  • 3.2 Molecular Contamination
  • 3.3 Ionic Contamination and Metallic Contaminants
  • 3.4 Microbial Contamination
  • 4 Product Surface Cleanliness Levels
  • 4.1 Surface Cleanliness
  • 5 Summary
  • Acknowledgment
  • Disclaimer
  • References
  • 3 The Use of Surfactants in Enhanced Particle Removal During Cleaning
  • 1 Introduction
  • 1.1 Industrial Perspective
  • 1.2 Historical Perspective
  • 2 Surfactant Behavior in Solution
  • 3 Interaction Forces and Particle Removal
  • 3.1 Introduction to Interaction Forces
  • 3.2 Measurement of Surface Forces
  • 3.3 Adhesion
  • 3.4 Particle Removal Forces
  • 3.5 Modification of Surface Forces Using Surfactants
  • 3.6 Measurement of Particle Removal
  • 3.7 Enhanced Particle Removal Results Associated With Surfactant Use
  • 3.8 Postcleaning Surfactant Removal
  • 3.9 Selection of Surfactants for Cleaning Purposes
  • 3.10 Mathematical Modeling of Enhanced Particle Removal Using Surfactants
  • 4 Summary
  • Acknowledgment
  • References
  • 4 Particle Removal by Surfactants During Semiconductor Cleaning
  • 1 Introduction
  • 1.1 Si Wafer Cleaning
  • 1.2 Post-Chemical Mechanical Planarization (PCMP) Cleaning
  • 2 Overview of Particle Removal by Surfactants During Semiconductor Cleaning
  • 2.1 Surfactant Types, Characteristics, and Their Uses
  • 2.2 Mechanisms of Particle Removal in the Presence of Surfactants
  • 3 Application of Surfactants for Particle Removal During Semiconductor Cleaning
  • 3.1 Silicon Wafer Cleaning
  • 3.2 Post-CMP Cleaning Process
  • 3.2.1 Si Post-CMP Cleaning
  • 3.2.2 Oxide Post-CMP Cleaning
  • 3.2.3 Metal Post-CMP Cleaning
  • 3.2.4 III-V Material Post-CMP Cleaning
  • 4 Summary
  • References

Ejemplares similares