Solution processed metal oxide thin films for electronic applications /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Cui, Zheng, Korotchenkov, G. S. (Gennadi�i Sergeevich)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Amsterdam : Elsevier, 2020.
Colección:Metal oxides series.
Temas:
Thin films.
Metallic oxides.
Couches minces.
Oxydes m�etalliques.
Metallic oxides
Thin films
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Cover
  • Title
  • Copyright
  • Contents
  • Contributors
  • Volume Editor Biography
  • Preface to the series
  • Chapter 1
  • Introduction
  • 1.1
  • Solution-processed electronics
  • 1.2
  • Metal oxides in solution
  • 1.3
  • Structure of the book
  • References
  • Chapter 2
  • Metal oxide semiconductors and conductors
  • 2.1
  • Introduction
  • 2.2
  • n-Type metal oxides
  • 2.2.1
  • In2O3
  • 2.2.2
  • ZnO
  • 2.2.3
  • SnO2
  • 2.2.4
  • ZnO-In2O3-SnO2 (ZITO)
  • 2.3
  • P-type metal oxides
  • 2.3.1
  • Cu2O
  • 2.3.2
  • NiO
  • 2.3.3
  • SnO
  • References
  • Chapter 3
  • Metal oxide dielectrics
  • 3.1
  • Introduction
  • 3.2
  • Basics and theory of dielectrics
  • 3.3
  • Roles of dielectric layers in thin-film transistors
  • 3.4
  • High-k metal oxide dielectrics
  • References
  • Chapter 4
  • Sol-gel precursor inks and films
  • 4.1
  • Introduction
  • 4.2
  • Fundamental of sol-gel process
  • 4.3
  • Sol-gel precursor inks
  • 4.4
  • Sol-gel process of metal oxide film
  • 4.4.1
  • Al2O3 film
  • 4.4.2
  • HfO2 film
  • 4.4.3
  • ZnO film
  • 4.4.4
  • TiO2 film
  • 4.5
  • Other precursors-based metal oxides inks and films
  • References
  • Chapter 5
  • Nanoparticles inks
  • 5.1
  • Introduction
  • 5.2
  • Synthesis of metal oxide nanoparticles
  • 5.2.1
  • Hot-injection method
  • 5.2.2
  • Hydrothermal or solvothermal method
  • 5.2.3
  • One-pot heating method
  • 5.2.4
  • Microwave-assisted method
  • 5.2.5
  • Precipitation method
  • 5.2.6
  • Sol-gel method
  • 5.2.7
  • Continuous flow method
  • 5.2.8
  • Ball-milling method
  • 5.3
  • Characterization and properties of metal oxide nanoparticles
  • 5.3.1
  • Measurement methods
  • 5.3.2
  • Physical and chemical properties
  • 5.4
  • Formulation of metal oxide nanoparticles inks
  • 5.4.1
  • Surfactants
  • 5.4.2
  • Long-term stability
  • References
  • Chapter 6
  • Coating and printing processes
  • 6.1
  • Introduction
  • 6.2
  • Nonpatternable solution processes
  • 6.2.1
  • Spin coating
  • 6.2.2
  • Spray coating
  • 6.2.3
  • Bar coating
  • 6.3
  • Patternable solution processes
  • 6.3.1
  • Inkjet printing
  • 6.3.2
  • Templated printing
  • 6.4
  • Roll-to-roll solution processes
  • 6.5
  • Self-aligned solution processes
  • References
  • Chapter 7
  • Thermal processes
  • 7.1
  • Introduction
  • 7.2
  • Internal annealing
  • 7.3
  • External annealing
  • 7.3.1
  • UV annealing
  • 7.3.2
  • Microwave annealing
  • 7.3.3
  • High-pressure annealing
  • 7.4
  • Low-temperature enabled flexible electronics
  • References
  • Chapter 8
  • Applications in photovoltaics
  • 8.1
  • Introduction
  • 8.2
  • Metal oxides as buffer layers for OPVs
  • 8.3
  • Electron transport layer
  • 8.3.1
  • ZnO
  • 8.3.2
  • TiO2
  • 8.3.3
  • Other metal oxides
  • 8.4
  • Hole transport layer
  • 8.4.1
  • MoO3
  • 8.4.2
  • V2O5
  • 8.4.3
  • WOx
  • 8.4.4 NiO
  • 8.4.5
  • CuOx
  • 8.4.6
  • Metal oxide composites
  • 8.5
  • Metal oxides as buffer layer for perovskite PV
  • 8.6
  • Electron extraction layer
  • 8.6.1
  • TiO2
  • 8.6.2
  • ZnO
  • 8.6.3
  • SnO2
  • 8.6.4
  • Other metal oxides
  • 8.7
  • Hole extraction layer
  • 8.7.1
  • NiO
  • 8.7.2
  • CuxO
  • 8.7.3
  • MoOx
  • 8.7.4
  • Metal oxide composites

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