Embedded mechatronic systems. 2, Analyses of failures, modeling, simulation and optimization /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: El Hami, Abdelkhalak (Editor ), Pougnet, Philippe (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : Kidlington : ISTE, Ltd. ; Elsevier, 2020.
Edición:Second edition.
Temas:
Embedded computer systems.
Mechatronics.
Syst�emes enfouis (Informatique)
M�ecatronique.
Embedded computer systems
Mechatronics
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Front Cover
  • Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization
  • Copyright page
  • Contents
  • Preface
  • 1. Highly Accelerated Testing
  • 1.1. Introduction
  • 1.2. Load characteristics of the Super HAT equipment
  • 1.3. Description of the Super HAT system
  • 1.4. Application
  • 1.5. Conclusion
  • 1.6. References
  • 2. Aging Power Transistors in Operational Conditions
  • 2.1. Introduction
  • 2.2. Aging microwave power electronic components under operational conditions
  • 2.3. Application to the study of microwave power transistors
  • 2.4. Conclusion
  • 2.5. References
  • 3. Physical Defects Analysis of Mechatronic Systems
  • 3.1. Introduction
  • 3.2. Equipment and methodology for analyzing failure inmechatronic systems
  • 3.3. Analysis of physical defects
  • 3.4. Conclusion
  • 3.5. References
  • 4. Impact of Voids in Interconnection Materials
  • 4.1. Introduction
  • 4.2. Thermal transfer and thermo-elasticity
  • 4.3. Description of the numerical method
  • 4.4. Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module
  • 4.5. Conclusion
  • 4.6. References
  • 5. Electro-Thermo-Mechanical Modeling
  • 5.1. Introduction
  • 5.2. Theory of electro-thermo-mechanical coupling
  • 5.3. Simulation of electro-thermo-mechanical behavior using the finite element method
  • 5.4. Example of an electro-thermo-mechanical simulation of an HBT transistor
  • 5.5. Modal analysis of mechanical components
  • 5.6. Stochastic modal analysis of structures
  • 5.7. Numerical identification of the elastic parameters of electronic components
  • 5.8. Example of modeling and simulation of the vibratory behavior of mechatronic components
  • 5.9. Conclusion
  • 5.10. List of abbreviations and symbols
  • 5.11. References
  • 6. Meta-Model Development
  • 6.1. Introduction
  • 6.2. Definition of a meta-model
  • 6.3. Selection of factors: screening
  • 6.4. Creation of designs of experiments
  • 6.5. Modeling of the response surface: PLS regression and Kriging
  • 6.6. Sensitivity analysis of the model: variance decomposition, Sobol criterion
  • 6.7. Robust design
  • 6.8. Conclusion
  • 6.9. References
  • 7. Probabilistic Study and Optimization of a Solder Interconnect
  • 7.1. Introduction
  • 7.2. Electronic equipment
  • 7.3. Thermal modeling of the electronic board
  • 7.4. Probabilistic study of the effect of thermomechanical stresses on a solder joint
  • 7.5. Optimization of the solder joint
  • 7.6. Conclusion
  • 7.7. References
  • 8. High-Efficiency Architecture for Power Amplifiers
  • 8.1. Introduction
  • 8.2. Main reliability parameters
  • 8.3. Methodology
  • 8.4. Aging tests
  • 8.5. Other results
  • 8.6. Origin of degradations: discussion
  • 8.7. Physical analysis
  • 8.8. Amplifier design rules
  • 8.9. Conclusion
  • 8.10. References
  • 9. Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)

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