Cargando…
Modeling, analysis, design, and tests for electronics packaging beyond Moore /
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingdom :
Woodhead Publishing, an imprint of Elsevier,
[2020]
|
| Colección: | Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | SCIDIR_on1128034384 | ||
| 003 | OCoLC | ||
| 005 | 20231120010424.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 191120s2020 enk ob 001 0 eng d | ||
| 040 | |a YDX |b eng |e pn |c YDX |d OPELS |d UKMGB |d UKAHL |d OCLCF |d BNG |d OCLCQ |d SFB |d OCLCQ |d OCLCO |d K6U |d OCLCQ | ||
| 015 | |a GBB9I6019 |2 bnb | ||
| 016 | 7 | |a 019610710 |2 Uk | |
| 020 | |a 9780081025338 |q (electronic bk.) | ||
| 020 | |a 0081025335 |q (electronic bk.) | ||
| 020 | |z 9780081025321 | ||
| 020 | |z 0081025327 | ||
| 035 | |a (OCoLC)1128034384 | ||
| 050 | 4 | |a TJ7870.15 | |
| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 100 | 1 | |a Zhang, Hengyun, |e author. | |
| 245 | 1 | 0 | |a Modeling, analysis, design, and tests for electronics packaging beyond Moore / |c Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao. |
| 264 | 1 | |a Duxford, United Kingdom : |b Woodhead Publishing, an imprint of Elsevier, |c [2020] | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Woodhead Publishing series in electronic and optical materials | |
| 490 | 1 | |a Series on advanced electronic packaging technology and key materials | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Online resource; title from digital title page (viewed on February 4, 2020). | |
| 650 | 0 | |a Electronic apparatus and appliances |x Packaging. | |
| 650 | 6 | |a Appareils �electroniques |x Emballage. |0 (CaQQLa)201-0202003 | |
| 650 | 7 | |a Electronic apparatus and appliances |x Packaging. |2 fast |0 (OCoLC)fst00906815 | |
| 700 | 1 | |a Che, Faxing, |e author. | |
| 700 | 1 | |a Lin, Tingyu, |e author. | |
| 700 | 1 | |a Zhao, Wensheng, |e author. | |
| 776 | 0 | 8 | |i Print version: |a Zhang, Hengyun. |t Modeling, analysis, design, and tests for electronics packaging beyond Moore |z 0081025327 |z 9780081025321 |w (OCoLC)1071140290 |
| 830 | 0 | |a Woodhead Publishing series in electronic and optical materials. | |
| 830 | 0 | |a Series on advanced electronic packaging technology and key materials. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780081025321 |z Texto completo |