Advanced adhesives in electronics : materials, properties and applications /

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and pr...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Alam, M. O., Bailey, C.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cambridge : Woodhead Pub., 2011.
Colección:Woodhead Publishing in materials.
Temas:
Electronics > Materials.
Coatings.
Sealing compounds.
�Electronique > Mat�eriaux.
Rev�etements.
Produits d'�etanch�eit�e.
coating (material)
caulking compound.
TECHNOLOGY & ENGINEERING > Mechanical.
Sealing compounds
Coatings
Adhesive joints
Adhesives
Electronic packaging > Materials
Electronics > Materials
Acceso en línea:Texto completo
Tabla de Contenidos:
  • pt. 1. Types of adhesives
  • pt. 2. Processing and properties.

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