Encapsulation technologies for electronic applications /
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...
Clasificación: | Libro Electrónico |
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Autores principales: | Ardebili, Haleh (Autor), Zhang, Jiawei (Autor), Pecht, Michael (Autor) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Oxford, United Kingdom :
William Andrew,
[2019]
|
Edición: | Second edition. |
Colección: | Materials and processes for electronic applications series.
|
Temas: | |
Acceso en línea: | Texto completo |
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