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Encapsulation technologies for electronic applications /
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Oxford, United Kingdom :
William Andrew,
[2019]
|
| Edición: | Second edition. |
| Colección: | Materials and processes for electronic applications series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | SCIDIR_on1057341368 | ||
| 003 | OCoLC | ||
| 005 | 20231120010319.0 | ||
| 006 | m o d | ||
| 007 | cr cnu|||unuuu | ||
| 008 | 181018s2019 enka ob 001 0 eng d | ||
| 040 | |a N$T |b eng |e rda |e pn |c N$T |d N$T |d OPELS |d OCLCF |d YDX |d OCLCQ |d MERER |d D6H |d OCLCQ |d S2H |d OCLCO |d OCLCQ |d OCLCO |d K6U |d OCLCQ |d SFB |d OCLCQ | ||
| 019 | |a 1057375817 |a 1079906388 | ||
| 020 | |a 9780128119792 |q (electronic bk.) | ||
| 020 | |a 0128119799 |q (electronic bk.) | ||
| 020 | |z 9780128119785 | ||
| 020 | |z 0128119780 | ||
| 035 | |a (OCoLC)1057341368 |z (OCoLC)1057375817 |z (OCoLC)1079906388 | ||
| 050 | 4 | |a TK7871.15.P5 | |
| 072 | 7 | |a TEC |x 009070 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 100 | 1 | |a Ardebili, Haleh, |e author. | |
| 245 | 1 | 0 | |a Encapsulation technologies for electronic applications / |c Haleh Ardebili, Jiawei Zhang, Michael G. Pecht. |
| 250 | |a Second edition. | ||
| 264 | 1 | |a Oxford, United Kingdom : |b William Andrew, |c [2019] | |
| 300 | |a 1 online resource : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials and processes for electronic applications series | |
| 588 | 0 | |a Online resource; title from PDF title page (EBSCO, viewed October 19, 2018). | |
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. | ||
| 650 | 0 | |a Electronic apparatus and appliances |x Plastic embedment. | |
| 650 | 6 | |a Encapsulation (�Electronique) |0 (CaQQLa)201-0074277 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances |x Plastic embedment. |2 fast |0 (OCoLC)fst00906816 | |
| 700 | 1 | |a Zhang, Jiawei, |e author. | |
| 700 | 1 | |a Pecht, Michael, |e author. | |
| 776 | 0 | 8 | |i Print version: |a Ardebili, Haleh. |t Encapsulation technologies for electronic applications. |b Second edition. |d Oxford, United Kingdom : William Andrew, [2019] |z 0128119780 |z 9780128119785 |w (OCoLC)1007042873 |
| 830 | 0 | |a Materials and processes for electronic applications series. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780128119785 |z Texto completo |