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Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability /
"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and...
| Clasificación: | Libro Electrónico |
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| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingdom :
Woodhead Publishing is an imprint of Elsevier,
[2018]
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| Colección: | Woodhead Publishing series in electronic and optical materials.
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| Temas: | |
| Acceso en línea: | Texto completo |