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Advanced polyimide materials : synthesis, characterization, and applications /
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and sp...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Amsterdam, Netherlands :
Elsevier,
[2018]
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| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 245 | 0 | 0 | |a Advanced polyimide materials : |b synthesis, characterization, and applications / |c edited by Shi-Yong Yang. |
| 264 | 1 | |a Amsterdam, Netherlands : |b Elsevier, |c [2018] | |
| 264 | 4 | |c �2018 | |
| 300 | |a 1 online resource : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
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| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Vendor-supplied metadata. | |
| 505 | 0 | |6 880-01 |a Intro; Title page; Table of Contents; Copyright; List of Contributors; About the Editor; Preface; Chapter 1. Advanced Polyimide Films; Abstract; 1.1 Introduction; 1.2 Chemistry of Polyimide Films; 1.3 Thermal Curing of Polyimide Films; 1.4 Structures and Properties of Polyimide Films; 1.5 Surface Modification of Polyimide Films; 1.6 Applications of Polyimide Films; 1.7 Summary; References; Chapter 2. Advanced Polyimide Fibers; Abstract; 2.1 Introduction; 2.2 Synthesis of Spinning Resin Solutions; 2.3 Preparation of Polyimide Fibers; 2.4 Structure and Properties of Polyimide Fibers. | |
| 505 | 8 | |a 2.5 Applications of Polyimide Fibers2.6 Summary; References; Further Reading; Chapter 3. Polyimide Matrices for Carbon Fiber Composites; Abstract; 3.1 Introduction; 3.2 NA-endcapped Thermoset Matrix Resins; 3.3 PE-endcapped Oligoimide Resins; 3.4 Properties of Polyimide/Carbon Fiber Composites; 3.5 Applications of Polyimide/Carbon Fiber Composites; 3.6 Summary; References; Chapter 4. Super Engineering Plastics and Forms; Abstract; 4.1 Introduction; 4.2 Compression-Molded Polyimide Materials; 4.3 Injection and Extrusion Processed Polyimide Materials. | |
| 505 | 8 | |a 4.4 Structures and Melt Processabilities of Aromatic Polyimide Resins4.5 Meltable Thermoplastic Polyimide Composites; 4.6 Reactive End-Capped Meltable Polyimide Resins; 4.7 Heat-resistant Polyimide Foams; 4.8 Thermally Stable Flexible Polyimide Aerogels; 4.9 Summary; References; Chapter 5. Polyimides for Electronic Applications; Abstract; 5.1 Introduction; 5.2 Polyimide Materials for Microelectronics; 5.3 Polyimide Materials for Optoelectric Planar Displays; 5.4 Polyimide Materials for Optoelectronic Flexible Displays; 5.5 Polyimide Materials for Electronic Memories; 5.6 Summary; References. | |
| 505 | 8 | |a Chapter 6. Polyimide Gas Separation MembranesAbstract; 6.1 Introduction; 6.2 Mechanisms of Gas Separation and Testing Methods; 6.3 Structures and Properties of Polyimide Membranes; 6.4 Intrinsically Microporous Polyimide Membranes; 6.5 Hydroxyl-functionalized Polyimide and Its Derived Polybenzoxazole Membranes; 6.6 Polyimide-Derived Carbon Molecular Sieve Membranes; 6.7 In Summary; References; Chapter 7. Polyimide Proton Exchange Membranes; Abstract; 7.1 Introduction; 7.2 Monomer Synthesis; 7.3 Polyimide Preparations; 7.4 Ion Exchange Membrane Properties; 7.5 Fuel Cell Performance. | |
| 520 | |a Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. | ||
| 650 | 0 | |a Polyimides. | |
| 650 | 6 | |a Polyimides. |0 (CaQQLa)201-0246275 | |
| 650 | 7 | |a polyimide. |2 aat |0 (CStmoGRI)aat300014553 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Chemical & Biochemical. |2 bisacsh | |
| 650 | 7 | |a Polyimides |2 fast |0 (OCoLC)fst01070521 | |
| 700 | 1 | |a Yang, Shi-Yong, |e editor. | |
| 776 | 0 | 8 | |i Print version: |t Advanced polyimide materials. |d Amsterdam, Netherlands : Elsevier, [2018] |z 012812640X |z 9780128126400 |w (OCoLC)1004355196 |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780128126400 |z Texto completo |
| 880 | 8 | |6 505-01/(S |a 7.6 SummaryReferences; Chapter 8. Soluble and Low-κ Polyimide Materials; Abstract; 8.1 Introduction; 8.2 Structures and Properties of Soluble Aromatic Polyimides; 8.3 Applications of Soluble Aromatic PIs; 8.4 Low-κ Polyimide Materials; References; Index. | |