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Handbook of silicon wafer cleaning technology /
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal as...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, MA :
William Andrew,
[2018]
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| Edición: | Third edition. |
| Colección: | Materials science and process technology series.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Handbook of Silicon Wafer Cleaning Technology; Handbook of Silicon Wafer Cleaning Technology; Copyright; Contents; List of Contributors; Foreword; Preface and Acknowledgments; I Introduction and Overview; 1
- Overview and Evolution of Silicon Wafer Cleaning Technology�a#x88;#x97;; 1.1 INTRODUCTION; 1.2 IMPORTANCE OF CLEAN AND CONDITIONED WAFER SURFACES; 1.2.1 Wafer Cleaning and Surface Conditioning Technology; 1.2.2 Wafer Cleaning and Surface Conditioning for Integrated Circuit Manufacturing; 1.3 OVERVIEW OF WAFER CONTAMINATION ASPECTS
- 1.3.1 Types and Origins of Contaminants and Defectivity1.3.2 Types of Semiconductor Wafers; 1.3.3 Effects of Contaminants and Defectivity on Silicon Device; 1.3.4 Prevention of Contamination and Defectivity; 1.4 OVERVIEW OF WAFER CLEANING AND SURFACE CONDITIONING TECHNOLOGY; 1.4.1 Liquid Processes and Wafer Drying Techniques; 1.4.2 Wet-Chemical Cleaning Processes; 1.4.2.1 Hydrofluoric Acid Solutions; 1.4.2.2 Sulfuric Acid and Hydrogen Peroxide Mixtures; 1.4.2.3 Original RCA Cleaning Process; 1.4.2.4 Modifications of the RCA Cleaning Process; 1.4.2.5 Alternative Cleaning Solutions
- 1.4.3 Alternative Wet-Chemical Cleaning and Surface Conditioning Systems1.4.3.1 Ohmi Clean; 1.4.3.2 IMEC Clean; 1.4.3.3 Diluted Dynamic Clean; 1.4.3.4 Single-Wafer/Short-Cycle Clean; 1.4.4 Equipment for Implementing Wet-Chemical Cleaning; 1.4.5 Wafer Rinsing, Drying, and Storing; 1.4.5.1 Wafer Rinsing; 1.4.5.2 Wafer Drying; 1.4.5.3 Wafer Storage; 1.4.6 Dry Cleaning and Surface Conditioning Processes; 1.4.6.1 General Considerations; 1.4.6.2 Vapor-Phase Cleaning Processes and Methods; 1.4.6.2.1 HF Vapor Etching, Cleaning, and Surface Conditioning
- 1.4.6.2.2 Ultraviolet/Ozone Cleaning for Removal of Organics1.4.6.2.3 UV/Chlorine Vapor-Phase Cleaning for Metal Removal; 1.4.6.2.4 Organochemical Vapor-Phase Cleaning Processes; 1.4.6.3 Plasma Stripping and Cleaning; 1.4.6.3.1 Introduction; 1.4.6.3.2 Stripping of Bulk Photoresist; 1.4.6.3.3 Removal of Etch Residues; 1.4.6.3.4 Predeposition Cleaning; 1.4.6.3.5 Surface Conditioning; 1.4.6.3.6 Cryogenic Aerosol and Supercritical Fluid Cleaning; 1.4.6.3.7 Cryogenic Aerosol Cleaning and Conditioning; 1.4.6.3.8 Supercritical Fluid Cleaning; 1.5 EVOLUTION OF WAFER CLEANING SCIENCE AND TECHNOLOGY
- 1.5.1 Period from 1950 to 19601.5.2 Period from 1961 to 1971; 1.5.2.1 Radiochemical Studies of Surface Contamination; 1.5.2.1.1 Development of the Original RCA Wafer Cleaning Procedure; 1.5.3 Period from 1972 to 1989; 1.5.3.1 Chronological Survey of the Literature on H2O2-Based Cleans; 1.5.3.2 Other Important Advances; 1.5.4 Period from 1989 to 1992; 1.5.4.1 Wet-Chemical Cleaning Processes; 1.5.4.2 Vapor-Phase Cleaning Methods; 1.5.5 Period From 1993 to 2006; 1.5.5.1 Trends and Milestones; 1.5.5.2 Liquid Processes and Wafer Drying Technology