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Embedded mechatronic systems. Volume 1, Analysis of failures, predictive reliability /
In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborati...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Amsterdam :
Elsevier,
2015.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Embedded Mechatronic Systems; Copyright; Contents; Preface; Chapter 1: Reliability-Based Design Optimization; 1.1. Introduction; 1.2. Reliability-Based Design Optimization; 1.3. Conclusion; 1.4. Bibliography; Chapter 2: Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices; 2.1. Introduction; 2.2. Relationship Between the Ellipsometric Parameters and the Optical Characteristics of a Sample; 2.3. Rotating Component or Phase Modulator Ellipsometers; 2.4. Relationship Between Ellipsometric Parameters and Intensity of the Detected Signal.
- 2.5. Analysis of Experimental Data2.6. The Stack Structural Model; 2.7. The Optical Model; 2.8. Application of Ellipsometry Technique; 2.9. Conclusion; 2.10. Bibliography; Chapter 3: Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities; 3.1. Introduction; 3.2. Theory of Metallic Cavities; 3.3. Effect of Metal Cavities on the Radiated Emissions of Microwave Circuits; 3.4. Approximation of the Electromagnetic Field Radiated in the Presence of the Cavity from the Electromagnetic Field Radiated without Cavity; 3.5. Conclusion.
- 3.6. BibliographyChapter 4: Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques; 4.1. Introduction; 4.2. Speckle Interferometry; 4.3. Moir�e Projection; 4.4. Structured Light Projection; 4.5. Conclusion; 4.6. Bibliography; Chapter 5: Characterization of Switching Transistors Under Electrical Overvoltage Stresses; 5.1. Introduction; 5.2. Stress Test Over ESD/EOV Electric Constraints; 5.3 Simulation Results; 5.4. Experimental Setup; 5.5. Conclusion; 5.6. Bibliography.
- Chapter 6: Reliability of Radio Frequency Power Transistors to Electromagnetic and Thermal Stress6.1. Introduction; 6.2. The GaN Technology; 6.3. Radiated Electromagnetic Stress; 6.4. RF CW Continuous Stress; 6.5. Thermal Exposure; 6.6. Combined Stresses: RF CW + Electromagnetic (EM) and Electric + EM; 6.7. Conclusion; 6.8. Bibliography; Chapter 7: Internal Temperature Measurement of Electronic Components; 7.1. Introduction; 7.2. Experimental Setup; 7.3. Measurement Results; 7.4. Conclusion; 7.5. Bibliography; Chapter 8: Reliability Prediction of Embedded Electronic Systems: The FIDES Guide.
- 8.1. Introduction8.2. Presentation of the FIDES guide; 8.3. FIDES Calculation on an Automotive Mechatronic System; 8.4. Conclusion; 8.5. Bibliography; Chapter 9: Study of the Dynamic Contact Between Deformable Solids; 9.1. Introduction; 9.2. Preliminaries; 9.3. Main Results; 9.4. Proposed Numerical Method; 9.5. Numerical Results; 9.6. Conclusion; 9.7. Bibliography; List of Authors; Index; Summary of Volume 2.