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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /

This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Wong, E. -H. (Ee-Hua) (Autor), Mai, Y. W., 1946- (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cambridge, UK : Woodhead Publishing, [2015]
Colección:Woodhead Publishing series in electronic and optical materials ; no. 81.
Temas:
Acceso en línea:Texto completo

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