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150330s2015 enk ob 001 0 eng d |
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|b eng
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|d K6U
|d UUM
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|d U3W
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|d WYU
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|a GBB519012
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|a 017050408
|2 Uk
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|a 962433805
|a 1066617257
|a 1235828539
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|a 9780124200852
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|a 0124200850
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|z 9780124200319
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|z 0124200311
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|a (OCoLC)905853607
|z (OCoLC)962433805
|z (OCoLC)1066617257
|z (OCoLC)1235828539
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|a TK7871.95
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|a 621.3815/284
|2 23
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|a FinFET modeling for IC simulation and design :
|b using the BSIM-CMG standard /
|c Yogesh Singh Chauhan [and more].
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|a London, UK :
|b Academic Press,
|c 2015.
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|a 1 online resource
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Includes index.
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|a Online resource; title from PDF title page (ScienceDirect, viewed March 30, 2015).
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|a Includes bibliographical references and index.
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|a This book explains FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard. It gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters. You will learn: why you should use FinFET; physics and operation of FinFET; details of the FinFET standard model (BSIM-CMG); parameter extraction in BSIM-CMG; FinFET circuit design and simulation. --
|c Edited summary from book.
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|a Front Cover; FinFET Modeling for IC Simulation and Design: Using the BSIM-CMG Standard; Copyright; Contents; Author Biographies; Preface; Chapter 1:FinFET-From device concept to standard compact model; 1.1 The root cause of short-channel effects in the twenty-first century MOSFETs; 1.2 The thin-body MOSFET concept; 1.3 The FinFET and a new scaling path for MOSFETs; 1.4 Ultra-thin-body FET; 1.5 FinFET compact model-the bridge between FinFET technology and IC design; 1.6 A brief history of the first standard compact model, BSIM; 1.7 Core and real-device models.
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|a 1.8 The industry standard FinFET compact modelReferences; Chapter 2: Compact models for analog and RF applications; 2.1 Introduction; 2.2 Important Compact Model Metrics; 2.3 Analog Metrics; 2.3.1 Quiescent Operating Point; 2.3.2 Geometric Scalability; 2.3.3 Variability Model; 2.3.4 Intrinsic Voltage Gain; 2.3.5 Speed: Unity Gain Frequency; 2.3.6 Noise; 2.3.7 Linearity and Symmetry; Harmonic distortion; Gain compression; Memory effects; Intermodulation distortion; 2.3.8 Symmetry; 2.4 RF Metrics; 2.4.1 Two-Port Parameters; 2.4.2 The Need for Speed.
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|a The maximum unity power gain frequency (fmax) Mason's unilateral gain U; 2.4.3 Non-Quasi-Static Model; 2.4.4 Noise; Minimum achievable noise figure (Fmin); Simple model for FET noise; Phase noise; Phase noise derivation: Lorentzian spectrum; Phase noise and flicker noise; 2.4.5 Linearity; Memory effects; Other distortion metrics; 2.5 Conclusion; References; Chapter 3:Core model for FinFETs; 3.1 Core Model for Double-Gate FinFETs; 3.2 Unified FinFET Compact Model; Chapter 3 Appendix: Explicit surface potential model; 3A.1 Continuous Starting Function.
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|a 3A.2 Quartic Modified Iteration: Implementation and EvaluationReferences; Chapter 4:Channel current and real device effects; 4.1 Introduction; 4.2 Threshold Voltage Roll-Off; 4.3 Subthreshold Slope Degradation; 4.4 Quantum Mechanical Vth Correction; 4.5 Vertical-Field Mobility Degradation; 4.6 Drain Saturation Voltage, Vdsat; 4.6.1 Extrinsic Case (RDSMOD=1 and 2); 4.6.2 Intrinsic Case (RDSMOD = 0); 4.7 Velocity Saturation Model; 4.8 Quantum Mechanical Effects; 4.8.1 Effective Width Model; 4.8.2 Effective Oxide Thickness/Effective Capacitance; 4.8.3 Charge Centroid Calculation for Accumulation.
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|a 4.9 Lateral Nonuniform Doping Model4.10 Body Effect Model for a Bulk FinFET (BULKMOD=1); 4.11 Output Resistance Model; 4.11.1 Channel-Length Modulation; 4.11.2 Drain-Induced Barrier Lowering; 4.12 Channel Current; References; Chapter 5:Leakage currents; 5.1 Weak-Inversion Current; 5.2 Gate-Induced Source and Drain Leakages; 5.2.1 GIDL/GISL Current Formulation in BSIM-CMG; 5.3 Gate Oxide Tunneling; 5.3.1 Gate Oxide Tunneling Formulation in BSIM-CMG; 5.3.2 Gate-to-Body Tunneling Current in Depletion/Inversion; 5.3.3 Gate-to-Body Tunneling Current in Accumulation.
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|a Field-effect transistors
|x Computer simulation.
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650 |
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|a Integrated circuits
|x Computer simulation.
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|a Transistors �a effet de champ
|0 (CaQQLa)201-0053281
|x Simulation par ordinateur.
|0 (CaQQLa)201-0379159
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650 |
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|a Circuits int�egr�es
|x Simulation par ordinateur.
|0 (CaQQLa)201-0180814
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650 |
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|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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650 |
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|a Integrated circuits
|x Computer simulation
|2 fast
|0 (OCoLC)fst00975537
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700 |
1 |
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|a Chauhan, Yogesh Singh,
|e author.
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776 |
0 |
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|i Print version:
|z 9780124200319
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856 |
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|u https://sciencedirect.uam.elogim.com/science/book/9780124200319
|z Texto completo
|