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Handbook of ceramics grinding and polishing /
Handbook of Ceramics Grinding and Polishing meets the growing need in manufacturing industries for a clear understanding of the latest techniques in ceramics processing. The properties of ceramics make them very useful as components-they withstand high temperatures and are durable, resistant to wear...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Oxford, UK ; Waltham, MA :
William Andrew,
[2015]
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| Edición: | Second edition. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover; Title page; Table of Contents; Copyright Page; Contributors; Abstract; 1.1. Introduction; 1.2. Wear mechanisms of ceramics materials; 1.3. Fundamental properties and selection criteria; 1.4. Microstructural reinforcement of ceramics; 1.5. Conclusion and outlook; Chapter 1: Properties of Ceramics; Abstract; 2.1. Deformation; 2.2. Dislocation; 2.3. Slip mechanism; 2.4. Twinning mechanism; 2.5. Fracture of ceramic materials; 2.6. Indentation in ceramic materials; Chapter 2: Deformation and Fracture of Ceramic Materials; Abstract; 3.1. Typology of abrasive processes.
- 3.2. Tribology of abrasive processes3.3. Single point scratch tests; 3.4. Multi point scratch tests; 3.5. General model of abrasive processes; 3.6. Surface topography and surface integrity; Chapter 3: Abrasive Processes; Abstract; 4.1. Fundamentals of grinding; 4.2. Grinding tools; 4.3. Conditioning of grinding wheels; 4.5. Cooling lubrication; 4.6. Environmental issues; 4.8. Properties of ground surface; 4.9. Grinding machines; Chapter 4: Grinding; Abstract; 5.1. Typology of the honing process; 5.2. Honing and superfinishing tools; 5.3. Honing and superfinishing machines.
- 5.4. Honing technology5.5. Double face grinding; Chapter 5: Honing and Superfinishing; Abstract; 6.1. Introduction; 6.2. Typology of processes with loose abrasives; 6.3. Lapping; 6.4. Polishing; 6.5. Chemical compound polishing; 6.6. Ultrasonic Lapping; 6.7. Abrasive Flow Machining; Chapter 6: Lapping and Polishing; Abstract; 7.1. Introduction; 7.2. Basic system; 7.3. Basic principles; 7.4. Electrical aspects of ELID grinding; 7.5. Grinding wheels for ELID applications; 7.6. ELID grinding of ceramics; 7.7. Material removal mechanisms in grinding of ceramics and glasses.
- 7.8. Comparison between ELID and other grinding techniques7.9. Applications of ELID grinding; 7.10. Conclusions; Chapter 7: ELID Grinding and Polishing; Abstract; 8.1. Introduction; 8.2. UV bonding techniques; 8.3. Manufacturing of UV-bonded diamond wheel; 8.4. Kinematic analysis of grind/lap; 8.5. Effects of UV-bonded wheel; 8.6. Optimal methods for improving grind/lap of ceramics; Chapter 8: Grind/Lap of Ceramics with UV-Bonded Diamond Wheels; Abstract; 9.1. Introduction; 9.2. Fundamentals of ELID; 9.3. Kinematics of the ELID grinding with lapping kinematics.
- 9.4. Modifications, preparations, and setup9.5. Results; Chapter 9: ELID Grinding with Lapping Kinematics; Appendix: Applications to Optoelectronics Materials; Index.