Cargando…
Reliability characterisation of electrical and electronic systems /
This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text de...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK :
Woodhead Publishing,
[2015]
|
| Colección: | Woodhead Publishing series in electronic and optical materials ;
no. 74. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Reliability Characterisation of Electrical and Electronic Systems; Copyright; Contents; List of contributors; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Chapter 1: Introduction; 1.1. Introduction; 1.2. The focus of the book; 1.2.1. Reliability characterisation; 1.2.2. Electrical and electronic systems; 1.2.3. The readers and the contributing authors; 1.3. Reliability science and engineering fundamentals (Chapters 2-4Chapter 2Chapter 3Chapter 4); 1.3.1. Reliability and stupidity; 1.3.2. Physics-of-failure thinking.
- 1.3.3. Acquiring observational evidence1.4. Reliability methods in component and system development (Chapters 5-9Chapter 5Chapter 6Chapter 7Chapter 8Chapter 9); 1.4.1. Components and devices; 1.4.2. Micro- and nanointegrated circuits; 1.4.3. More complex systems; 1.5. Reliability modelling and testing in specific applications (Chapters 10 and 11Chapter 10Chapter 11); 1.5.1. Application examples; 1.5.2. Verification techniques; 1.5.3. Block modelling with ALT techniques; 1.6. Conclusion; References; Chapter 2: Reliability and stupidity; 2.1. Introduction.
- 2.2. Common mistakes in reliability engineering2.2.1. Inadequate integration of reliability engineering with product development; 2.2.2. Focus on ``probability� � in conventional definition of reliability engineering; 2.2.3. Quantification of reliability; 2.2.4. Ignoring cause and effect relationship in reliability engineering; 2.2.5. Incorrect understanding of the meaning of MTBF; 2.2.6. Inadequate failure testing during product development; 2.2.7. Reliability engineering activities performed at incorrect time during development.
- 2.2.8. Reliability engineering activities performed by incorrect personnel2.2.9. Non-value adding reliability engineering activities; 2.2.10. Incorrect viewpoint on cost of reliability; 2.3. Conclusion; References; Chapter 3: Physics-of-failure (PoF) methodology for electronic reliability; 3.1. Introduction; 3.2. Reliability; 3.3. PoF models; 3.4. PoF reliability assessment; 3.5. Applications of PoF to ensure reliability; 3.6. Summary and areas of future interest; References; Chapter 4: Modern instruments for characterizing degradation in electrical and electronic equipment; 4.1. Introduction.
- 4.1.1. Modern instruments4.2. Destructive techniques; 4.2.1. Cross sections; 4.2.2. Jet etching and depotting components; 4.2.3. Chemical analysis; 4.2.3.1. Ion chromatography; 4.2.3.2. Infrared spectroscopy; 4.2.3.3. Raman spectroscopy; 4.2.3.4. Mass spectrometric techniques; 4.2.3.5. SEM imaging with energy-dispersive X-ray and wavelength-dispersive X-ray analyses; 4.2.3.6. Focused ion beam sample preparation; 4.2.3.7. Transmission electron microscopy (TEM); 4.3. Nondestructive techniques; 4.3.1. Visual inspection; 4.3.2. Optical microscopy; 4.3.2.1. Stereomicroscopes.