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SCIDIR_ocn898475089 |
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OCoLC |
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20231120111928.0 |
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m o d |
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cr cnu|||unuuu |
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141222t20142015ne ob 001 0 eng d |
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|a N$T
|b eng
|e rda
|e pn
|c N$T
|d EBLCP
|d N$T
|d YDXCP
|d OPELS
|d OCLCF
|d DEBSZ
|d U3W
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|d AU@
|d OCLCQ
|d OCLCO
|d OCLCQ
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|a 899568375
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|a 9781782420439
|q electronic bk.
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|a 1782420436
|q electronic bk.
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|z 9781782420354
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|z 1782420355
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|a (OCoLC)898475089
|z (OCoLC)899568375
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|a TK7871
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|a TEC
|x 009070
|2 bisacsh
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0 |
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|a 621.381
|2 23
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|a Handbook of flexible organic electronics :
|b materials, manufacturing and applications /
|c edited by Stergios Logothetidis.
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264 |
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1 |
|a Amsterdam :
|b Elsevier,
|c [2014]
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264 |
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|c �2015
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|a 1 online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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490 |
1 |
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|a Woodhead Publishing series in electronic and optical materials ;
|v number 68
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504 |
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|a Includes bibliographical references and index.
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520 |
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|a Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices.
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|a Front Cover; Related titles; Handbook of Flexible Organic Electronics; Copyright; Contents; List of contributors; Woodhead Publishing Series in Electronic and Optical Materials; Part One Properties and materials; 1 -- Mechanics of curvature and strain in flexible organic electronic devices; 1.1 Introduction; 1.2 Stress and strain analyses; 1.3 Failure under tensile stress; 1.4 Failure under compressive stress; 1.5 Mechanical test methods; 1.6 Toward compliant and stretchable electronics; 1.7 Conclusions; Acknowledgements; References; 1. Appendix: Nomenclature.
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|a 2 -- Structural and electronic properties of fullerene-based organic materials: density functional theory-based calculations2.1 Introduction; 2.2 Theoretical background; 2.3 Structural transformations of fullerenes based on DFT calculations; 2.4 Prototype impurities in fullerene crystals and electronic effects; 2.5 Summary and future trends; References; 3 -- Hybrid and nanocomposite materials for flexible organic electronics applications; 3.1 Introduction; 3.2 Production methods; 3.3 Properties; 3.4 Limitations; 3.5 Electronics applications; 3.6 Future trends.
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|a 3.7 Sources of further information and adviceAcknowledgements; References; 4 -- Organic polymeric semiconductor materials for applications in photovoltaic cells; 4.1 Introduction; 4.2 Polymeric electron donors for bulk-heterojunction photovoltaic solar cells; 4.3 Fullerene and polymeric-based electron acceptors for bulk heterojunction photovoltaic solar cells; 4.4 Hybrid structures of polymer, copolymer semiconductors with carbon nanostructures; 4.5 Conclusions; References; Part Two Technologies; 5 -- High-barrier films for flexible organic electronic devices; 5.1 Introduction.
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|a 5.2 Encapsulation of flexible OEs5.3 Permeability mechanisms through barrier materials; 5.4 Permeation measurement techniques; 5.5 Advances in high-barrier materials; 5.6 Conclusions; Acknowledgements; References; 6 -- Advanced interconnection technologies for flexible organic electronic systems; 6.1 Introduction; 6.2 Materials and processes; 6.3 Reliability; 6.4 Summary and future trends; Acknowledgements; References; 7 -- Roll-to-roll printing and coating techniques for manufacturing large-area flexible organic electronics; 7.1 Introduction; 7.2 Printing techniques; 7.3 Coating techniques.
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|a 7.4 Specialist coating techniques7.5 Encapsulation techniques; 7.6 Applications; 7.7 Future trends; References; 8 -- Integrated printing for 2D/3D flexible organic electronic devices; 8.1 Introduction; 8.2 Fundamentals of inkjet printing; 8.3 Electronic inks; 8.4 Vertically integrated inkjet-printed electronic passive components; 8.5 Conclusions; References; 9 -- In situ characterization of organic electronic materials using X-ray techniques; 9.1 Introduction; 9.2 Grazing incidence X-ray diffraction; 9.3 Temperature-dependent studies; 9.4 In situ X-ray studies; 9.5 Conclusions; Acknowledgements.
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650 |
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0 |
|a Organic electronics.
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650 |
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0 |
|a Electronics
|x Materials.
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650 |
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0 |
|a Information display systems.
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650 |
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6 |
|a �Electronique organique.
|0 (CaQQLa)201-0419955
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650 |
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6 |
|a �Electronique
|x Mat�eriaux.
|0 (CaQQLa)201-0016374
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650 |
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6 |
|a Affichage (Technique)
|0 (CaQQLa)201-0013576
|
650 |
|
7 |
|a TECHNOLOGY & ENGINEERING / Mechanical
|2 bisacsh
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650 |
|
7 |
|a Electronics
|x Materials
|2 fast
|0 (OCoLC)fst00907562
|
650 |
|
7 |
|a Information display systems
|2 fast
|0 (OCoLC)fst00972541
|
650 |
|
7 |
|a Organic electronics
|2 fast
|0 (OCoLC)fst01047687
|
650 |
|
7 |
|a Electrical & Computer Engineering.
|2 hilcc
|
650 |
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7 |
|a Engineering & Applied Sciences.
|2 hilcc
|
650 |
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7 |
|a Electrical Engineering.
|2 hilcc
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700 |
1 |
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|a Logothetidis, Stergios,
|e editor.
|
776 |
0 |
8 |
|i Print version:
|z 1782420355
|z 9781782420354
|w (OCoLC)889647405
|
830 |
|
0 |
|a Woodhead Publishing series in electronic and optical materials ;
|v number 68.
|
856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/book/9781782420354
|z Texto completo
|