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Electronics reliability-- calculation and design /
Electronics Reliability-Calculation and Design provides an introduction to the fundamental concepts of reliability. The increasing complexity of electronic equipment has made problems in designing and manufacturing a reliable product more and more difficult. Specific techniques have been developed t...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Oxford :
Pergamon Press,
1966.
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| Colección: | Commonwealth and international library. Electrical engineering division.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Electronics Reliability-Calculation and Design; Copyright Page ; Table of Contents; PREFACE; ACKNOWLEDGEMENT; CHAPTER 1. BASIC RELIABILITY THEORY; The Arithmetic Mean; Frequency Distribution; The Median; The Mode; Scatter or Dispersion of Measurements; The Normal and Binomial Distributions; Questions on Chapter 1; CHAPTER 2. CALCULATING EQUIPMENT AND SYSTEM RELIABILITY; The Exponential Law of Reliability; A ""Paper"" Study of Reliability; Prediction of Reliability; Failure Rate; Useful Life; Unreliability; Product Law of Reliability
- Integration of Equipment Reliability into System ReliabilityImportance of the Time Factor; System Prediction from Typical Equipment Failure Rates; Calculation of Life Tests; Determination of Confidence Limits; Confidence Limits based on Standard Deviation; Estimation of the Reliability for Non-exponential Cases; Questions on Chapter 2; CHAPTER 3. SAFETY AND DERATING FACTORS; Reliability through Redundancy; Standby Redundancy; Weight and Reliability Factors; Group Redundancy; Reliability through Derating; Derating of valves; Derating of Semiconductors; Derating of Resistors
- Derating for CapacitorsDerating for Transformers, Inductors, Coils, Magnetic Amplifiers; Derating for Connector Assemblies; Derating for Relays and Switches; Questions on Chapter 3; CHAPTER 4. RELIABILITY IN CONSTRUCTION; General Considerations; Constructional Techniques; Protection of Components and Printed Wiring Boards using Polysulphide Rubber; Back-sealmg of Plugs and Sockets; Encapsulation of Sub-assemblies or Modules; Solderless Wrapped Connections; Environmental Tests of Wrapped Joints; Eliminating Mechanical Stress; Shock and Vibration Mounts
- A Few Practical Considerations of Vibration and Shock MountsCooling of Electronic Equipment; The Use of Liquid Cooling Methods; Insulation and Cooling; The Need for Efficient Sealing; Inert Filling Gases; Questions on Chapter 4; CHAPTER 5. ENVIRONMENTAL EFFECTS ON RELIABILITY; Climatic Conditions; Environmental Stresses; The Environment and its Effect on Electronics; Questions on Chapter 5; CHAPTER 6. RELIABILITY THROUGH MICROELECTRONICS; Thin Film Circuits; Semiconductor Integrated Circuits; Hybrid Integrated Circuits; Reliability Evaluation of Integrated Circuits
- Senuconductor Integrated CircuitsStatistical Data on the Reliability Tests; Questions on Chapter 6; CHAPTER 7. FAILURE RATES FOR ELECTRONIC COMPONENTS; Distribution of Failure Rates; Changes in Failure Rates with Different Vibration Stress Levels; Lowest Recorded Failure Rates; INDEX