VLSI and computer architecture /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Shankar, Ravi
Otros Autores: Fernandez, Eduardo B., 1936-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: San Diego : Academic Press, �1989.
Colección:VLSI electronics ; v. 20.
Temas:
Integrated circuits > Very large scale integration.
Computer architecture.
Circuits int�egr�es �a tr�es grande �echelle.
Ordinateurs > Architecture.
TECHNOLOGY & ENGINEERING > Mechanical.
Computer architecture
Integrated circuits > Very large scale integration
Acceso en línea:Texto completo
Texto completo
Tabla de Contenidos:
  • Front Cover
  • VLSI and Computer Architecture
  • Copyright Page
  • Table of Contents
  • Preface to Part I
  • Preface to Part II
  • Part I: SYSTEM DESIGN
  • Chapter 1. An Introduction to VLSI
  • 1.1. THE EVOLUTION OF DIGITAL ELECTRONICS TOWARD VLSI AND BEYOND
  • 1.2. A COMPARISON OF DIFFERENT VLSI TECHNOLOGIES
  • Chapter 2. Silicon MOS Technology
  • 2.1. INTRODUCTION
  • 2.2. DEVICE CHARACTERISTICS
  • 2.3. LOGIC FAMILIES
  • 2.4. MEMORY ELEMENTS
  • 2.5. FABRICATION
  • 2.6. SCALING AND DESIGN RULES
  • 2.7. SCALING CONSTRAINTS AND VLSI TRENDS
  • 2.8. SYSTEM PERFORMANCE CONSIDERATIONS2.9. PROCESSOR DESIGN CONSIDERATIONS
  • Chapter 3. Silicon Bipolar Integrated Circuits
  • 3.1. INTRODUCTION
  • 3.2. LOGIC FAMILIES
  • 3.3. MEMORY ELEMENTS
  • 3.4. FABRICATION
  • 3.5. SYSTEM PERFORMANCE CONSIDERATIONS
  • 3.6. PROCESSOR DESIGN CONSIDERATIONS
  • 3.7. BIPOLAR TRENDS
  • Chapter 4. Gallium-Arsenide Technology
  • 4.1. INTRODUCTION
  • 4.2. DEVICES
  • 4.3. FABRICATION
  • 4.4. LOGIC FAMILIES
  • 4.5. SYSTEM PERFORMANCE CONSIDERATIONS
  • 4.6. PROCESSOR DESIGN CONSIDERATIONS
  • Chapter 5. Superconductive Electronics5.1. INTRODUCTION
  • 5.2. DEVICES
  • 5.3. FABRICATION
  • 5.4. LOGIC FAMILIES
  • 5.5. MEMORY ELEMENTS
  • 5.6. SYSTEM PERFORMANCE CONSIDERATIONS
  • 5.7. PROCESSOR DESIGN CONSIDERATIONS
  • Chapter 6. An Overview of Digital VLSI System Design
  • 6.1. INTRODUCTION
  • 6.2. DESIGN METHODOLOGIES
  • 6.3. DESIGN AIDS AND TOOLS
  • 6.4. DESIGN STYLES
  • 6.5. COMPARISON OF DIFFERENT DESIGN STYLES
  • 6.6. CURRENT RESEARCH AND DEVELOPMENT EFFORTS
  • Chapter 7. Design Automation Tools
  • 7.1. INTRODUCTION
  • 7.2. STANDARD INTERFACES7.3. LOGIC SYNTHESIS AND OPTIMIZATION
  • 7.4. PLACEMENT AND ROUTING
  • 7.5. TESTING
  • 7.6. SILICON COMPILERS
  • Chapter 8. Examples of CAD Systems and VLSI Designs
  • 8.1. INTRODUCTION
  • 8.2. BIPOLAR SYSTEMS
  • 8.3. MOS SYSTEMS: UNIVERSITY-BASED DESIGNS
  • 8.4. MOS SYSTEMS: COMMERCIAL DESIGNS
  • 8.5. GALLIUM-ARSENIDE SYSTEMS
  • 8.6. SUPERCONDUCTING SYSTEMS
  • Chapter 9. VLSI Trends
  • 9.1. FABRICATION
  • 9.2. VERY HIGH SPEED INTEGRATED CIRCUITS
  • 9.3. TESTABILITY AND TESTING
  • 9.4. THREE-DIMENSIONAL INTEGRATED CIRCUITS
  • 9.5. FAULT TOLERANCE TECHNIQUES AND YIELD9.6. PACKAGING
  • 9.7. INTEGRATION OF ANALOG FUNCTIONS
  • References
  • Part II: Architectural Aspects
  • Chapter 10. Introduction
  • 10.1. MOTIVATION
  • 10.2. VLSI AS AN IMPLEMENTATION MEDIUM
  • 10.3. ADVANCES
  • 10-4. OVERVIEW OF PART II
  • Chapter 11. Architectural Requirements
  • 11.1. GENERAL OBJECTIVES OF AN ARCHITECTURE
  • 11.2. INSTRUCTION SET ARCHITECTURE
  • 11.3. MICROARCHITECTURE
  • 11.4. SUPPORT FOR DATA STRUCTURES AND DATA TYPES
  • 11.5. SUPPORT FOR SUBROUTINE CALLS
  • 11.6. MEMORY MANAGEMENT

Ejemplares similares