American microelectronics data annual. 1964-65 /
American Microelectronics Data Annual 1964-65 provides comprehensive information on different microelectronics available in the U.S.
Clasificación: | Libro Electrónico |
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Otros Autores: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Oxford :
Pergamon Press,
1964.
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Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- B12001 three input buffer amplifierG12002/G12003 two, three and four input NAND/NOR; Two-dimensional approach; CHAPTER 5. AUTONETICS Microelectronics; Integrated circuit approach; Hybrid approach; CHAPTER 6. BENDIX : The Bendix Semiconductor Division Approach to Monolithic Microcircuits. Program
- Steps of Fabrication
- Tentative specifications for active slices (amplifier and switching); CHAPTER 7. BUNKER-RAMO Thin-Film Hybrid Microcircuits
- CHAPTER 8. BURROUGHS : Thin Film Memory Planes. Introduction
- Behavior of thin film memory elements
- Thin film operating characteristics- Product information (thin film memory planes BIP-1000 and BIP-1001)
- Applications information (noise-magnetic shielding
- the transformer-diode matrix
- current drivers
- the information driver
- the sense amplifier)CHAPTER 9. CENTRALAB 'PEC' Packaged Electronic Circuits; Properties of 'PEC' resistors; 'PEC' packaged transistor amplifiers; Type YAD-006-01 four-stage amplifier; Type YAD-006-02 four-stage amplifier; Type YAD-006-03F6U four-stage amplifier
- Type YAD-009-01F6U three-stage amplifierType YAD-013-01A6H four-stage amplifier; CHAPTER 11. CTS Cermet Microminiature Modules; Thin film cermet capacitors; 'Cerafer' series of resistor wafers, microelements and modules; 'Ceradot' cermet pellet resistors
- CHAPTER 12. FAIRCHILD: Characteristics and Applications of Micrologic Elements Introduction-Choice of circuit and characteristics of DCTL-Micrologic elements
- Applications of Micrologic elements-Counters
- Shift registers
- Full adders
- Code conversion-Two's and nine's complementers -Reclocking circuit-Some considerations on integrated circuit assembly techniques -Reliability considerations
- Conclusions
- ReferencesCHAPTER 10. CONSOLIDATED REACTIVE METALS : Semiconductor alloy data; Fairchild Planar Epitaxial Micrologic; Type 900 buffer; Type 901 counter adapter; Type 902 flip-flop