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VLSI electronics. microstructure science / Volume 3 :
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York :
Academic Press,
1982.
|
| Colección: | VLSI Electronics Microstructure Science.
|
| Temas: | |
| Acceso en línea: | Texto completo Texto completo |
Tabla de Contenidos:
- Front Cover; VLSI Electronics: Microstructure Science; Copyright Page; Table of Contents; List of Contributors; Preface; Chapter 1. Impact of VLSI on Computer Architectures; I. Introduction; II. Single-Chip Computers; III. Special-Purpose VLSI Chips; IV. Conclusion; References; Chapter 2. VLSI Design and Design Aid Requirements Charles House and Kent Hardage; I. Introduction; II. State-of-the-Art versus Workhorse Technologies; III. Designer Goals in Workhorse Technologies; IV. Next-Generation Requirements; V. The Problem and the Approach; VI. The Future; Acknowledgments; References.
- Additional ReferencesChapter 3 Design, Fabrication, and Performance of CCD Imagers; I. Introduction; II. Silicon CCD Imagers with Intrinsic Photoresponse; III. PtSi-Silicon Schottky-Barrier Infrared Image Sensors; IV. Other Infrared Imagers; V. Prospects for the Future; Acknowledgments; References; Chapter 4 Ultra-High-Speed GaAs VLSI: Approaches, Potential, and Progress; I. Introduction; II. GaAs Device Approaches for Ultra-High-Speed VLSI; III. Yield Analysis and Implications for VLSI Design; IV. The Schottky Diode-FET Logic Circuit Approach for Ultra-High-Speed GaAs VLSI.
- v. Planar GaAs LSI/VLSI Fabrication TechnologyVI. Experimental Performance Results for Planar SDFL LSI GaAs ICs; VII. Summary; Acknowledgments; References; Chapter 5 Computer Modeling of MOSFETs; I. Introduction; II. MOSFET Device Modeling; III. Results and Discussion; IV. Conclusions; Acknowledgments; References; Chapter 6 The Numerical Physics of Micron-Length and Submicron-Length Semiconductor Devices; I. Introduction; II. The Semiconductor Equations; III. The Boltzmann Transport Equation; IV. Quantum Transport Theory; V. Diffusion; Appendix A. Derivation of the Balance Equations.
- Appendix B. The Wigner Distribution FunctionAcknowledgments; References; Chapter 7 Optical Linewidth Measurements on Photomasks and Wafers; I. Introduction; II. Limitations of Traditional Methods; III. Modeling of the Optical Image; IV. Primary Linewidth-Measurement System; V. Primary Linewidth Measurements on Photomasks; VI. Linewidth Measurements with Conventional Optical Systems on Photomasks; VII. Linewidth Measurements on Other Materials; References; Chapter 8 The Effects of Materials Technology and Fabrication Tolerances on Guided-Wave Optical Communication and Signal Processing.
- I. IntroductionII. Optical Guided-Wave Components in Communications and Signal-Processing Systems; III. The Effect of Fabrication Techniques on the Performance of Optical Guided-Wave Components; IV. Conclusion; References; Chapter 9. The Impact of VLSI on CAM; I. Introduction; II. CAM's Structure; III. VLSI's Impact on CAM; IV. Education and Training; Acknowledgments; References; Index ; Contents of Other Volumes.