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VLSI electronics. microstructure science / Volume 3 :
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York :
Academic Press,
1982.
|
| Colección: | VLSI Electronics Microstructure Science.
|
| Temas: | |
| Acceso en línea: | Texto completo Texto completo |
MARC
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| 245 | 0 | 0 | |a VLSI electronics. |n Volume 3 : |b microstructure science / |c edited by Norman G. Einspruch. |
| 264 | 1 | |a New York : |b Academic Press, |c 1982. | |
| 300 | |a 1 online resource : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a VLSI Electronics Microstructure Science ; |v v. 3 | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Front Cover; VLSI Electronics: Microstructure Science; Copyright Page; Table of Contents; List of Contributors; Preface; Chapter 1. Impact of VLSI on Computer Architectures; I. Introduction; II. Single-Chip Computers; III. Special-Purpose VLSI Chips; IV. Conclusion; References; Chapter 2. VLSI Design and Design Aid Requirements Charles House and Kent Hardage; I. Introduction; II. State-of-the-Art versus Workhorse Technologies; III. Designer Goals in Workhorse Technologies; IV. Next-Generation Requirements; V. The Problem and the Approach; VI. The Future; Acknowledgments; References. | |
| 505 | 8 | |a Additional ReferencesChapter 3 Design, Fabrication, and Performance of CCD Imagers; I. Introduction; II. Silicon CCD Imagers with Intrinsic Photoresponse; III. PtSi-Silicon Schottky-Barrier Infrared Image Sensors; IV. Other Infrared Imagers; V. Prospects for the Future; Acknowledgments; References; Chapter 4 Ultra-High-Speed GaAs VLSI: Approaches, Potential, and Progress; I. Introduction; II. GaAs Device Approaches for Ultra-High-Speed VLSI; III. Yield Analysis and Implications for VLSI Design; IV. The Schottky Diode-FET Logic Circuit Approach for Ultra-High-Speed GaAs VLSI. | |
| 505 | 8 | |a v. Planar GaAs LSI/VLSI Fabrication TechnologyVI. Experimental Performance Results for Planar SDFL LSI GaAs ICs; VII. Summary; Acknowledgments; References; Chapter 5 Computer Modeling of MOSFETs; I. Introduction; II. MOSFET Device Modeling; III. Results and Discussion; IV. Conclusions; Acknowledgments; References; Chapter 6 The Numerical Physics of Micron-Length and Submicron-Length Semiconductor Devices; I. Introduction; II. The Semiconductor Equations; III. The Boltzmann Transport Equation; IV. Quantum Transport Theory; V. Diffusion; Appendix A. Derivation of the Balance Equations. | |
| 505 | 8 | |a Appendix B. The Wigner Distribution FunctionAcknowledgments; References; Chapter 7 Optical Linewidth Measurements on Photomasks and Wafers; I. Introduction; II. Limitations of Traditional Methods; III. Modeling of the Optical Image; IV. Primary Linewidth-Measurement System; V. Primary Linewidth Measurements on Photomasks; VI. Linewidth Measurements with Conventional Optical Systems on Photomasks; VII. Linewidth Measurements on Other Materials; References; Chapter 8 The Effects of Materials Technology and Fabrication Tolerances on Guided-Wave Optical Communication and Signal Processing. | |
| 505 | 8 | |a I. IntroductionII. Optical Guided-Wave Components in Communications and Signal-Processing Systems; III. The Effect of Fabrication Techniques on the Performance of Optical Guided-Wave Components; IV. Conclusion; References; Chapter 9. The Impact of VLSI on CAM; I. Introduction; II. CAM's Structure; III. VLSI's Impact on CAM; IV. Education and Training; Acknowledgments; References; Index ; Contents of Other Volumes. | |
| 650 | 0 | |a Integrated circuits |x Very large scale integration. | |
| 650 | 6 | |a Circuits int�egr�es �a tr�es grande �echelle. |0 (CaQQLa)201-0117255 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Micro�electronique. |2 eclas | |
| 650 | 7 | |a Integrated circuits |x Very large scale integration. |2 fast |0 (OCoLC)fst00975602 | |
| 700 | 1 | |a Einspruch, Norman G., |e editor. | |
| 776 | 0 | 8 | |i Print version: |t VLSI electronics |z 0122341015 |w (DLC) 81002877 |w (OCoLC)7462403 |
| 830 | 0 | |a VLSI Electronics Microstructure Science. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780122341038 |z Texto completo |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/bookseries/07367031/3 |z Texto completo |