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VLSI electronics : microstructure science, volume 5 /
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York :
Academic Press,
1982.
|
| Colección: | VLSI electronics ;
v. 5. |
| Temas: | |
| Acceso en línea: | Texto completo Texto completo |
Tabla de Contenidos:
- Front Cover; VLSI Electronics Microstructure Science; Copyright Page; Table of Contents; List of Contributors; Preface; Chapter 1. Automation for VLSI Manufacture; I. Introduction; II. VLSI Manufacturing Technology; III. Automation for VLSI Manufacture; IV. Summary; References; Chapter 2. Silicon Material Properties for VLSI Circuitry; I. Introduction; II. Fabrication of Silicon Material and VLSI Circuits: A Summary; III. Silicon Material Phenomena Important for VLSI Circuitry; IV. Electrical Effects of Point Defects and Crystal Strain on VLSI Circuitry.
- v. Historical Perspective on the Evolution of Silicon Material TechnologyVI. Conclusion; Recommendations; References; Chapter 3. High-Performance Computer Packaging and the Thin-Film Multichip Module; I. Introduction-The Trend for High-Performance Computer Packaging; II. The Multilayer Ceramic Module for LSI Chips; III. Challenges for Designing Future High-Performance Multichip Modules; IV. Thin-Film Interconnection Lines; V. The Delta-I Problem and On-Module Capacitor; VI. Thin-Film Line Fabrication and the Defect Problem; VII. Conclusion-The Thin-Film Module as a High-Performance Package.
- XIII. Examples of Device OperationXIV. Process Problems; XV. Technology Status and Forecast; Appendix. Optimum Cell Layout; References; Chapter 6. Solid-State Infrared Imaging; I. Introduction; II. Infrared Imaging Principles; III. Staring and Scanning FPAs; IV. Infrared Detectors and Readout Structures; V. Area and Line Arrays; VI. Array Technologies; VII. Array Characterization; VIII. Infrared-Imaging-System Performance; IX. Concluding Remarks; References; Chapter 7. Impact of Microelectronics upon Radar Systems; I. Overview; II. System Requirements Drive Technology.
- III. Subsystems and Technology RequirementsIV. Key Microelectronic Technologies; V. Summary; Selected References; Chapter 8. Materials Science, Chemistry, and Physics at Small Dimensions; I. Materials Science; II. Chemistry; III. Physics; References; Chapter 9. Quantum-Mechanical Limitations on Device Performance; I. Fundamental Limits on Logic Devices; II. Technology-Independent Quantum Limits; References; Index; Contents of Other Volumes.