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SCIDIR_ocn892068364 |
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OCoLC |
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20231120111759.0 |
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m o d |
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cr cnu---unuuu |
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141003s1982 nyua ob 001 0 eng d |
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|a OPELS
|b eng
|e rda
|e pn
|c OPELS
|d N$T
|d S4S
|d EBLCP
|d NLGGC
|d DEBSZ
|d YDXCP
|d OCLCQ
|d UAB
|d MERUC
|d INARC
|d OCLCQ
|d OTZ
|d STF
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
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019 |
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|a 897652042
|a 948650595
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|a 9781483217727
|q (electronic bk.)
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|a 1483217728
|q (electronic bk.)
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|z 0122341058
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|z 9780122341052
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|a (OCoLC)892068364
|z (OCoLC)897652042
|z (OCoLC)948650595
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|a TK7874
|b .V56 v.5eb
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|a TEC
|x 009070
|2 bisacsh
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082 |
0 |
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|a 621.381/73
|2 22
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|a VLSI electronics :
|b microstructure science, volume 5 /
|c edited by Norman G. Einspruch.
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264 |
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1 |
|a New York :
|b Academic Press,
|c 1982.
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300 |
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|a 1 online resource (xii, 404 pages) :
|b illustrations
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336 |
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|a text
|b txt
|2 rdacontent
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337 |
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|a computer
|b c
|2 rdamedia
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338 |
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|a online resource
|b cr
|2 rdacarrier
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1 |
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|a VLSI electronics ;
|v volume 5
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504 |
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|a Includes bibliographical references and index.
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|a Print version record.
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|a Front Cover; VLSI Electronics Microstructure Science; Copyright Page; Table of Contents; List of Contributors; Preface; Chapter 1. Automation for VLSI Manufacture; I. Introduction; II. VLSI Manufacturing Technology; III. Automation for VLSI Manufacture; IV. Summary; References; Chapter 2. Silicon Material Properties for VLSI Circuitry; I. Introduction; II. Fabrication of Silicon Material and VLSI Circuits: A Summary; III. Silicon Material Phenomena Important for VLSI Circuitry; IV. Electrical Effects of Point Defects and Crystal Strain on VLSI Circuitry.
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|a v. Historical Perspective on the Evolution of Silicon Material TechnologyVI. Conclusion; Recommendations; References; Chapter 3. High-Performance Computer Packaging and the Thin-Film Multichip Module; I. Introduction-The Trend for High-Performance Computer Packaging; II. The Multilayer Ceramic Module for LSI Chips; III. Challenges for Designing Future High-Performance Multichip Modules; IV. Thin-Film Interconnection Lines; V. The Delta-I Problem and On-Module Capacitor; VI. Thin-Film Line Fabrication and the Defect Problem; VII. Conclusion-The Thin-Film Module as a High-Performance Package.
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|a XIII. Examples of Device OperationXIV. Process Problems; XV. Technology Status and Forecast; Appendix. Optimum Cell Layout; References; Chapter 6. Solid-State Infrared Imaging; I. Introduction; II. Infrared Imaging Principles; III. Staring and Scanning FPAs; IV. Infrared Detectors and Readout Structures; V. Area and Line Arrays; VI. Array Technologies; VII. Array Characterization; VIII. Infrared-Imaging-System Performance; IX. Concluding Remarks; References; Chapter 7. Impact of Microelectronics upon Radar Systems; I. Overview; II. System Requirements Drive Technology.
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|a III. Subsystems and Technology RequirementsIV. Key Microelectronic Technologies; V. Summary; Selected References; Chapter 8. Materials Science, Chemistry, and Physics at Small Dimensions; I. Materials Science; II. Chemistry; III. Physics; References; Chapter 9. Quantum-Mechanical Limitations on Device Performance; I. Fundamental Limits on Logic Devices; II. Technology-Independent Quantum Limits; References; Index; Contents of Other Volumes.
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|a Integrated circuits
|x Very large scale integration.
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650 |
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|a Circuits int�egr�es �a tr�es grande �echelle.
|0 (CaQQLa)201-0117255
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650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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650 |
|
7 |
|a Integrated circuits
|x Very large scale integration
|2 fast
|0 (OCoLC)fst00975602
|
700 |
1 |
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|a Einspruch, Norman G.
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776 |
0 |
8 |
|i Print version:
|t VLSI electronics
|z 0122341058
|w (OCoLC)24324159
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830 |
|
0 |
|a VLSI electronics ;
|v v. 5.
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856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/book/9780122341052
|z Texto completo
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856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/bookseries/07367031/5
|z Texto completo
|