Cargando…
In-circuit testing /
In-Circuit Testing discusses what an in-circuit test (ICT) is and what it can and cannot do. It answers many questions on how tests are actually carried out, with the benefits and drawbacks of the techniques. The emphasis throughout is towards practical problem solving, and many of the examples used...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Jordan Hill, Oxford, England ; Boston :
Butterworth-Heinemann,
1994.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; In-Circuit Testing; Copyright Page; Table of Contents; Preface; Abbreviations; Chapter 1. Introduction; 1.1 What is ICT?; 1.2 What does ICT do?; 1.3 What does ICT not do?; 1.4 How does ICT work?; 1.5 What faults can be found by ICT?; 1.6 ICT of surface mounted assemblies; 1.7 ICT ATE suppliers; 1.8 References; Chapter 2. Application; Preamble; 2.1 A typical application; 2.2 The wrong use of ICT; 2.3 The correct use of ICT; 2.4 ICT in the test strategy; 2.5 Fitting ICT into manufacturing; 2.6 Buying an ICT equipment; 2.7 Cost of ownership/LCC; 2.8 Additional factors.
- 2.9 The financial decision2.10 Presenting the justification to management; 2.11 Break-even table; 2.12 References; Chapter 3. Programming
- procedures, problems and solutions; 3.1 Introduction; 3.2 Standard procedures; 3.3 The standard program; 3.4 Software; 3.5 Guarding; 3.6 Programming requirements; 3.7 Programming workstations; 3.8 Summary; Chapter 4. Interfacing
- procedures, problems and solutions; 4.1 Introduction; 4.2 The ATE; 4.3 The basic fixture; 4.4 The test probe; 4.5 Drilling the platten; 4.6 Wiring the fixture; 4.7 Problems; 4.8 Fixture maintenance; 4.9 Vacuum pumps.
- 4.10 Summary4.11 References; Chapter 5. Fault diagnosis; Preamble; 5.1 Short circuits; 5.2 Open circuits; 5.3 Faulty analogue components; 5.4 Assembly faults; 5.5 Faulty digital components; 5.6 Faults generated in test; 5.7 Rework and repair stations; 5.8 Summary; 5.9 References; Chapter 6. Designing for in-circuit test; 6.1 General; 6.2 Mechanical design of the PCB; 6.3 Formal rules for testability; 6.4 Mechanical requirements; 6.5 CAD aspects; 6.6 Design for test checklist; References; Chapter 7. Conclusion; 7.1 Analysing the strategy; 7.2 Refining the strategy; 7.3 Cost effectiveness.
- 7.4 Fault analysis and feedback7.5 ICT and yield; 7.6 Boundary scan; 7.7 Automatic board handlers; 7.8 Real time fault analysis; 7.9 Computer integrated test; 7.10 Test area management; 7.11 Conclusion; 12. References; Index.