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In-circuit testing /

In-Circuit Testing discusses what an in-circuit test (ICT) is and what it can and cannot do. It answers many questions on how tests are actually carried out, with the benefits and drawbacks of the techniques. The emphasis throughout is towards practical problem solving, and many of the examples used...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Buckroyd, Allen
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Jordan Hill, Oxford, England ; Boston : Butterworth-Heinemann, 1994.
Temas:
Acceso en línea:Texto completo

MARC

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100 1 |a Buckroyd, Allen. 
245 1 0 |a In-circuit testing /  |c Allen Buckroyd. 
264 1 |a Jordan Hill, Oxford, England ;  |a Boston :  |b Butterworth-Heinemann,  |c 1994. 
300 |a 1 online resource (xiv, 168 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
588 0 |a Print version record. 
505 0 |a Front Cover; In-Circuit Testing; Copyright Page; Table of Contents; Preface; Abbreviations; Chapter 1. Introduction; 1.1 What is ICT?; 1.2 What does ICT do?; 1.3 What does ICT not do?; 1.4 How does ICT work?; 1.5 What faults can be found by ICT?; 1.6 ICT of surface mounted assemblies; 1.7 ICT ATE suppliers; 1.8 References; Chapter 2. Application; Preamble; 2.1 A typical application; 2.2 The wrong use of ICT; 2.3 The correct use of ICT; 2.4 ICT in the test strategy; 2.5 Fitting ICT into manufacturing; 2.6 Buying an ICT equipment; 2.7 Cost of ownership/LCC; 2.8 Additional factors. 
505 8 |a 2.9 The financial decision2.10 Presenting the justification to management; 2.11 Break-even table; 2.12 References; Chapter 3. Programming -- procedures, problems and solutions; 3.1 Introduction; 3.2 Standard procedures; 3.3 The standard program; 3.4 Software; 3.5 Guarding; 3.6 Programming requirements; 3.7 Programming workstations; 3.8 Summary; Chapter 4. Interfacing -- procedures, problems and solutions; 4.1 Introduction; 4.2 The ATE; 4.3 The basic fixture; 4.4 The test probe; 4.5 Drilling the platten; 4.6 Wiring the fixture; 4.7 Problems; 4.8 Fixture maintenance; 4.9 Vacuum pumps. 
505 8 |a 4.10 Summary4.11 References; Chapter 5. Fault diagnosis; Preamble; 5.1 Short circuits; 5.2 Open circuits; 5.3 Faulty analogue components; 5.4 Assembly faults; 5.5 Faulty digital components; 5.6 Faults generated in test; 5.7 Rework and repair stations; 5.8 Summary; 5.9 References; Chapter 6. Designing for in-circuit test; 6.1 General; 6.2 Mechanical design of the PCB; 6.3 Formal rules for testability; 6.4 Mechanical requirements; 6.5 CAD aspects; 6.6 Design for test checklist; References; Chapter 7. Conclusion; 7.1 Analysing the strategy; 7.2 Refining the strategy; 7.3 Cost effectiveness. 
505 8 |a 7.4 Fault analysis and feedback7.5 ICT and yield; 7.6 Boundary scan; 7.7 Automatic board handlers; 7.8 Real time fault analysis; 7.9 Computer integrated test; 7.10 Test area management; 7.11 Conclusion; 12. References; Index. 
520 |a In-Circuit Testing discusses what an in-circuit test (ICT) is and what it can and cannot do. It answers many questions on how tests are actually carried out, with the benefits and drawbacks of the techniques. The emphasis throughout is towards practical problem solving, and many of the examples used are of surface mount printed circuit boards (PCBs). The book contains separate chapters on application-fitting ICT into a typical test strategy and into the manufacturing environment. The buying decision is fully explored-choice of system, initial and ongoing costs, and preparation of the financial. 
546 |a English. 
650 0 |a Printed circuits  |x Testing. 
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650 7 |a TECHNOLOGY & ENGINEERING  |x Mechanical.  |2 bisacsh 
650 7 |a Printed circuits  |x Testing.  |2 fast  |0 (OCoLC)fst01076557 
776 0 8 |i Print version:  |a Buckroyd, Allen.  |t In-circuit testing  |z 9780750609302  |w (DLC) 93032070  |w (OCoLC)28721302 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9780750609302  |z Texto completo