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Green and sustainable computing. Part II /
Since its first volume in 1960, Advances in Computers has presented detailed coverage of innovations in computer hardware, software, theory, design, and applications. It has also provided contributors with a medium in which they can explore their subjects in greater depth and breadth than journal ar...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Amsterdam ; Boston :
Elsevier/AP,
2013.
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| Edición: | 1st ed. |
| Colección: | Advances in computers. Volume eighty eight, Green and sustainable computing,
pt. 2 |
| Temas: | |
| Acceso en línea: | Texto completo Texto completo |
Tabla de Contenidos:
- Half Title; Title Page; Copyright; CONTENTS; PREFACE; Energy-Aware High Performance Computing-A Survey; 1 Introduction; 1.1 What is HPC?; 1.1.1 Who has the Fastest-The Top500 List; 1.1.2 Is One Number Really Enough?; 1.2 HPC Goes Green; 1.3 The Quest for the Right Metric; 1.3.1 Power vs. Energy; 1.3.2 Data Center Metrics; 1.3.3 Application-Level Metrics; 1.4 Outline of This Chapter; 2 Hardware Power Management; 2.1 State-of-the-Art; 2.1.1 CPUs; 2.1.2 Accelerators-GPUs; 2.1.3 Memory; 2.1.4 Network and Storage; 2.2 Outlook; 2.2.1 CPUs; 2.2.2 Memory; 2.2.3 Interconnects
- 2.3 Energy-Aware Architectures2.3.1 Trends in x86 Clusters; 2.3.2 SoC-Based Systems; 2.3.3 IBM Blue Gene Family; 2.3.4 Application-Centric Architectures; 3 Software Aspects of Energy-Aware HPC; 3.1 Vendor-Specific Tools; 3.2 Scheduling; 3.3 Power Measurement and Modeling; 3.3.1 Power Measurement; 3.3.2 Power Consumption Modeling; 3.4 Tools to Optimize the Energy Consumption of HPC Applications; 3.4.1 Run-Time Systems; 3.5 Applications and Algorithms; 3.5.1 Communication Algorithms; 4 The eeClust Project; 4.1 Project Overview; 4.2 Application Analysis; 4.2.1 Automatic Energy Analysis
- 4.3 Hardware Management4.4 Benchmarking; 5 Conclusion; List of Abbreviations; References; Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design; 1 Introduction; 2 Fundamental Characteristics of Fluids in Micro-Channels; 2.1 3D-IC Structure with Micro-Channel Cooling; 2.2 Conservation Law of Fluid Dynamics; 2.3 Dimensionless Numbers in Fluid Mechanics; 2.4 3D-IC with Micro-Channels: Modeling; 2.4.1 Energy Conservation; 2.4.2 Momentum Conservation; 2.5 Single and Two Phase Flow; 2.6 Laminar and Turbulent Flow; 2.7 Fanning Friction Factor
- 3 Design Considerations of Micro-Channels in 3D-ICs3.1 Non-Uniform Power Profile; 3.2 TSV Constraint; 3.3 Thermal Stress; 4 3D-IC with Micro-Channels: Simplified Modeling; 4.1 Thermal Modeling; 4.1.1 Bulk Thermal Resistance; 4.1.2 RC Network; 4.1.3 Resistive Network; 4.2 Hydrodynamic Modeling; 4.2.1 Pressure Drop in Straight Micro-Channels; 4.2.2 Pressure Drop in Bended Micro-Channels; 4.3 Cooling Effectiveness with Respect to Micro-Channel Parameters; 4.3.1 Flow Rate; 4.3.2 Number of Micro-Channels; 4.3.3 Structure of Micro-Channels; 5 Micro-Channel Design Challenges
- 5.1 Micro-Channel Modeling5.2 Micro-Channel Infrastructure Design; 5.2.1 Straight Micro-Channel Shape Optimization; 5.2.2 Complex Micro-Channel Infrastructures; 5.2.3 Hotspot-Optimized Micro-Channel Infrastructure; 6 Runtime Thermal Management Using Micro-Channels; 7 Conclusion; References; Sustainable DVFS-enabled Multi-Core Architectures with on-chip Wireless Links; 1 Introduction; 2 Related Work; 3 Proposed Architecture; 3.1 Physical Layer Design; 3.2 Wireless Link Placement; 3.3 Dynamic Voltage and Frequency Scaling; 4 Performance Evaluation; 4.1 Performance Metrics