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SCIDIR_ocn830161134 |
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OCoLC |
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20231117044836.0 |
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m o d |
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cr |n||||||||| |
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130316s1983 enk o 000 0 eng d |
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|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d OPELS
|d IDEBK
|d N$T
|d OCLCF
|d OCLCQ
|d YDXCP
|d DEBSZ
|d OCLCQ
|d MERUC
|d OCLCQ
|d LEAUB
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
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| 020 |
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|a 9780444601322
|q (electronic bk.)
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| 020 |
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|a 0444601325
|q (electronic bk.)
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| 035 |
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|a (OCoLC)830161134
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| 050 |
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4 |
|a TA1677
|b .L365 1983
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| 072 |
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7 |
|a SCI
|x 050000
|2 bisacsh
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| 082 |
0 |
4 |
|a 620.112
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| 245 |
0 |
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|a Laser Materials Processing /
|c edited by Michael Bass.
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| 260 |
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|a Oxford :
|b Elsevier Science,
|c 1983.
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| 300 |
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|a 1 online resource (491 pages)
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Materials processing, theory and practices ;
|v v. 3
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0 |
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|a Front Cover; Laser Materials Processing; Copyright Page; Introduction to the series; Preface to volume 3; Advisory board; Table of Contents; Contents; Chapter 1. Lasers for laser materials processing; 1. Introduction; 2. The Nd:YAG laser; 3. The CO2 laser; Chapter 2. Laser cutting; 1. Introduction; 2. Laser-material interaction : a brief outline; 3. Industrial application of laser cutting; 4. Current research developments of the cutting process; 5� Theoretical models of the laser heating process; 6. Practical performance results; 7� Conclusion; References; Chapter 3. Laser welding.
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8 |
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|a 1. Introduction2. Principles of laser welding; 3. Laser welding variables; 4. Welding of various materials; 5. Heat transfer theory for laser welding; 6. Summary; References; Chapter 4. Laser heat treatment; 1. Early development and industrial use; 2. General description; 3. Experimental model; 4. Summary; References; List of laser heat treatment patents; Chapter 5. Rapid solidification laser processing at high power density; 1. Introduction; 2. Theory; 3. Microstructural considerations; 4. Processing; References; Chapter 6. Shaping materials with lasers; 1. Introduction.
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| 505 |
8 |
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|a 2. Laser assisted machining3. Laser machining; 4. Summary; References; Chapter 7. Laser processing of semiconductors; 1. Introduction; 2. Laser interactions with semiconductors; 3. Models of the process; 4. Methods of approach; 5. Processing with CW beams; 6. Processing with pulsed beams; 7. Application prospects; 8. Summary and outlook; References; Chapter 8: Nd. YAG laser applications survey; 1. Introduction; 2. Pulsed Nd:YAG applications; 3. Percussion drilling; 4. Cutting and large hole drilling; 5. Heat treating; References; Chapter 9. Considerations for lasers in manufacturing.
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|a 1. Introduction2. Economic justification; 3. Specifications for system; 4. Manpower, space, and facilities; 5. Spare parts, maintenance and field service; 6. Conclusion; References; Subject index.
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| 500 |
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|a Laser Materials Processing.
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| 588 |
0 |
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|a Print version record.
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| 650 |
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|a Lasers
|x Industrial applications.
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| 650 |
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6 |
|a Lasers
|x Applications industrielles.
|0 (CaQQLa)201-0259323
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| 650 |
|
7 |
|a SCIENCE
|x Nanoscience.
|2 bisacsh
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| 650 |
|
7 |
|a Lasers
|x Industrial applications
|2 fast
|0 (OCoLC)fst00992853
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| 700 |
1 |
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|a Bass, Michael,
|d 1939-
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| 776 |
0 |
8 |
|i Print version:
|a Bass, Michael.
|t Laser Materials Processing.
|d Oxford : Elsevier Science, �1983
|z 9780444863966
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| 830 |
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0 |
|a Materials processing, theory and practices ;
|v v. 3.
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| 856 |
4 |
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|u https://sciencedirect.uam.elogim.com/science/book/9780444863966
|z Texto completo
|
