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Advances in laser materials processing : technology, research and applications /
Because of its capacity for continuous development and flexibility of use, the laser has become a mainstream manufacturing tool in many industrial sectors. This timely book relays the state-of-the-art in laser materials processing technology and applications and likely advances to be made from curre...
| Clasificación: | Libro Electrónico |
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| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boca Raton : Oxford :
CRC Press ; Woodhead Pub.,
2010.
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| Colección: | Woodhead Publishing in mechanical engineering.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover; Advances inlaser materialsprocessing: Technology, research and applications; Copyright; Contents; Contributor contact details; Preface; Part I Overview and challenges for the future; 1 'Light' industry: an introduction to laser processing and its industrial applications; 1.1 What is a laser?; 1.2 Interaction of optical energy with matter; 1.3 Characteristics of optical energy; 1.4 Range of current industrial applications; 1.5 Future trends; 1.6 References and further reading; 2 The challenges ahead for laser macro, micro and nano manufacturing; 2.1 Introduction; 2.2 Laser cutting.
- 2.3 Laser welding2.4 Laser drilling; 2.5 Laser surface engineering; 2.6 Additive multiple layer manufacturing; 2.7 Micro/nano fabrication; 2.8 Fundamental beam/material interactions and process modelling; 2.9 Laser systems; 2.10 Conclusions; 2.11 References; Part II Laser cutting and machining; 3 Laser fusion cutting of difficult materials; 3.1 Introduction; 3.2 Principles involved in fusion laser cutting; 3.3 Experiences in laser cutting of difficult materials; 3.4 Attempts to improve cutting process; 3.5 Conclusions; 3.6 Acknowledgements; 3.7 References; 4 Laser-assisted glass cleaving.
- 4.1 Introduction4.2 The multiple laser system; 4.3 Numerical simulation; 4.4 Numerical results and discussions; 4.5 Crack propagation in laser cleaving; 4.6 Conclusions; 4.7 Acknowledgements; 4.8 References and further reading; 5 Laser dicing of silicon and electronics substrates; 5.1 Introduction; 5.2 Laser machining of silicon: an overview of the cutting process; 5.3 Conventional laser dicing of silicon wafer; 5.4 Other laser dicing techniques; 5.5 Laser-silicon interaction; 5.6 Laser processing of printed circuit board (PCB) substrates; 5.7 Conclusions; 5.8 References.
- 6 Laser machining of carbon fibre-reinforced plastic composites6.1 Introduction; 6.2 Laser fibre reinforced (FRP) composite interaction; 6.3 Investigation of UV laser machining of carbon fibre-reinforced plastics (CFRP); 6.4 Modelling of UV laser cutting/machining of carbon fibre-reinforced plastic (CFRP) materials; 6.5 Conclusions and future trends; 6.6 References; Part III Laser welding; 7 Understanding and improving process control in pulsed and continuous wave laser welding; 7.1 Introduction.
- 7.2 Laser spot welding results, and formation mechanisms and suppression procedures of welding defects7.3 Continuous wave (CW) laser welding results, and formation mechanisms and suppression procedures of welding defects; 7.4 Conclusions; 7.5 References; 8 Physical mechanisms controlling keyhole and melt pool dynamics during laser welding; 8.1 Introduction; 8.2 Keyhole formation and dynamics; 8.3 Melt pool dynamics; 8.4 Discussion; 8.5 Conclusions; 8.6 References; 8.7 List of symbols; 9 Laser microspot welding in electronics production; 9.1 Introduction; 9.2 State of the art.