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Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling /

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, auto...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Sha, Wei
Otros Autores: Wu, Xiaomin, Keong, K. G. (Kim Ghee)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cambridge, UK ; Philadelphia, PA : Woodhead Pub., 2011.
Colección:Woodhead Publishing in materials.
Temas:
Acceso en línea:Texto completo

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