Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling /
Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, auto...
Clasificación: | Libro Electrónico |
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Autor principal: | Sha, Wei |
Otros Autores: | Wu, Xiaomin, Keong, K. G. (Kim Ghee) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Cambridge, UK ; Philadelphia, PA :
Woodhead Pub.,
2011.
|
Colección: | Woodhead Publishing in materials.
|
Temas: | |
Acceso en línea: | Texto completo |
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