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Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling /
Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, auto...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK ; Philadelphia, PA :
Woodhead Pub.,
2011.
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| Colección: | Woodhead Publishing in materials.
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| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Sha, Wei. | |
| 245 | 1 | 0 | |a Electroless copper and nickel-phosphorus plating : |b processing, characterisation and modelling / |c W. Sha, X. Wu and K.G. Keong. |
| 260 | |a Cambridge, UK ; |a Philadelphia, PA : |b Woodhead Pub., |c 2011. | ||
| 300 | |a 1 online resource (xviii, 285 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Woodhead Publishing in materials | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 520 | |a Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries. Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applicationsChapters review areas such as surface morphology and residual stress, modelling surface structure, crystallisation of nickel-phosphorus deposits and hardness evolutionAn invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries. | ||
| 505 | 0 | |a Cover; Electroless copper and nickel-phosphorus plating: Processing, characterisation andmodelling; Copyright; Contents; Author contact details; Preface; Acknowledgements; 1Introduction to electroless copper andnickel-phosphorus (Ni-P) depositions; 1.1 Electroless copper deposition; 1.2 Electroless nickel-phosphorus (Ni-P) deposition; 1.3 How to plate the depositions in the laboratory; 1.4 Research objectives; 1.5 Structure of the book; 1.6 References; Part I Electroless copper depositions; 2Surface morphology evolution ofelectroless copper deposits. | |
| 505 | 8 | |a 2.1 Introduction and surface morphology of the substrate2.2 Formaldehyde high temperature solution deposits; 2.3 Glyoxylic acid high temperature solution deposits; 2.4 Formaldehyde high concentration low temperature (FHCLT) solution deposit; 2.5 Formaldehyde low concentration low temperature (FLCLT) solution deposit; 2.6 Glyoxylic acid high concentration low temperature (GHCLT) solution deposit; 2.7 Glyoxylic acid low concentration low temperature (GLCLT) solution deposit; 2.8 Electroplated and electroless copper deposits; 2.9 Conclusions. | |
| 505 | 8 | |a 3Cross-section of electroless copperdeposits and the void fraction3.1 Calculating the void fraction on an electron microscopy cross-section image; 3.2 Determination of the optimum threshold values of grey scale and noise; 3.3 The voids; 3.4 Conclusions; 3.5 References; 4 Crystal structure and surface residual stress of electroless copper deposits; 4.1 X-ray normal scan patterns and the crystal structures of the deposits; 4.2 Tilted scan patterns and the surface residual stress of the electroless copper; 4.3 The error in calculating the position and the relative intensities of the peaks. | |
| 505 | 8 | |a 4.4 The error in linear regression for surface residual stress analysis4.5 Conclusions; 5The atomic model of the diamond pyramidstructure in electroless copper deposits; 5.1 The unit diamond pyramid structure in a face centred cubic crystal lattice; 5.2 Multi-layer atomic model; 5.3 Twinning in the diamond pyramid model; 5.4 The role of surface stress in the formation of twinning in a diamond pyramid; 5.5 Conclusions; 5.6 References; 6Molecular dynamics (MD) simulation of thediamond pyramid structure in electrolesscopper deposits; 6.1 Simulation setup. | |
| 505 | 8 | |a 6.2 Preparing models for molecular dynamics calculation6.3 The effect of surface stress on the shape of the diamond pyramid structure; 6.4 The relaxation of the diamond pyramid structure with different sizes; 6.5 The effect of temperature on the relaxation of the diamond pyramid structure; 6.6 The effect of temperature on the formation of voids in the electroless deposit; 6.7 The formation and growth of the diamond pyramid structure in deposit; 6.8 The radial distribution function (RDF) and the Fourier transform of X-ray diffraction (XRD); 6.9 Conclusions. | |
| 650 | 0 | |a Nickel-plating. | |
| 650 | 0 | |a Electroless plating. | |
| 650 | 0 | |a Copper plating. | |
| 650 | 6 | |a Nickelage. |0 (CaQQLa)201-0089325 | |
| 650 | 6 | |a Placage non �electrolytique. |0 (CaQQLa)201-0089260 | |
| 650 | 6 | |a Cuivrage. |0 (CaQQLa)201-0181750 | |
| 650 | 7 | |a electroless plating. |2 aat |0 (CStmoGRI)aat300053999 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Technical & Manufacturing Industries & Trades. |2 bisacsh | |
| 650 | 7 | |a Copper plating |2 fast |0 (OCoLC)fst00878537 | |
| 650 | 7 | |a Electroless plating |2 fast |0 (OCoLC)fst00906469 | |
| 650 | 7 | |a Nickel-plating |2 fast |0 (OCoLC)fst01037523 | |
| 700 | 1 | |a Wu, Xiaomin. | |
| 700 | 1 | |a Keong, K. G. |q (Kim Ghee) | |
| 776 | 0 | 8 | |i Print version: |a Sha, Wei. |t Electroless copper and nickel-phosphorus plating. |d Cambridge, UK ; Philadelphia, PA : Woodhead Pub., 2011 |z 9781845698089 |z 1845698088 |
| 830 | 0 | |a Woodhead Publishing in materials. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9781845698089 |z Texto completo |